How about the surface treatment technology of aluminum substrate pcb?Yongmingsheng technology on aluminum substrate aluminum  pcb surface to do some expressions.

After the electrical components are inserted into the printed circuit board, they should be soldered automatically.In these processes, if there is material foaming, in addition to the printed circuit board processing technology is not reasonable, but also related to the immersion welding resistance of aluminum substrate.The poor soldering resistance of aluminum substrate leads to the reduction of system quality stability at best, and damages the whole component at worst.

Aluminum substrate is a composite material of resin, aluminum and copper foil.Resin and aluminum, copper foil thermal expansion coefficient is very different, therefore, in the external force, under the action of heat, produce uneven distribution of internal force in the plate.If water molecules and some low molecular matter remain in the pores of the plate interface, the concentrated stress will be larger under the condition of thermal shock.

If the adhesive fails to resist these internal destructive forces, lamination and foaming will occur between the copper foil and the substrate, or between the substrate layers, at the weak interface.To improve the solder resistance of aluminum substrate, it is necessary to reduce the factors that will destroy the structure of all sectors in the forming and high temperature of the plate.The improvement methods mainly include the surface treatment of copper foil and aluminum, the improvement of resin adhesive, and the control of pressure and temperature in the process of pressing.

The bonding strength of aluminum interface is generally determined by two parts:

First, aluminum base and adhesive aluminum base plate processing (thermal insulation adhesive main resin or adhesive) adhesive force;

Second, it is the adhesive force between the adhesive and the resin.

If the glue can penetrate into the surface layer of aluminum material well, and the aluminum substrate processing can be chemically cross-linked with the main resin well, the higher peel strength of the aluminum substrate can be guaranteed.

Aluminum surface treatment methods are oxidation, wire drawing, etc., are through the expansion of the surface area to enhance the adhesion.Generally, the surface area of oxidation is much larger than that of drawing, but the oxidation itself is also quite different.

The above is the aluminum substrate aluminum surface treatment technology.we are a professional aluminum substrate manufacturer. I hope this article will be of some help to you.