HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Deskrizzjoni fil-qosor:

Bordijiet ta 'ċirkwiti stampati HDI offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

parametri

Saffi: 8

Base Material:FR4 High Tg EM827

Ħxuna: 1.6 ± 0.10mm

Min.Hole Size：0.15mm

Minimu Linja Wisa / Spazju: 0.10mm / 0.10mm

Approvazzjoni Minima bejn Inner Layer PTH u Line ： 0.2mm

Daqs: 222mm × 120mm

Aspect Ratio：10.6 : 1

Trattament tal-wiċċ: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Applikazzjonijiet: Kompjuter

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PCB HDI is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

proċess ta 'produzzjoni HDI Bord:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Fuq kollox, il-proċess ta 'produzzjoni tal-pjanċa HDI hija kumplessa, li jeħtieġ li jitlesta wara ħafna drabi ta' produzzjoni għal żmien twil. Huwa mhux biss ir-rekwiżiti għolja għall-preċiżjoni u jinxtorob kontroll ta 'kull saff, iżda wkoll standards għoljin fil-materjali, tagħmir, l-ambjent u l-persunal tekniku.

YMS HDI PCB manufacturing capabilities:

Ħarsa ġenerali lejn il-kapaċitajiet tal-manifattura tal-PCB YMS HDI
Karatteristika	kapaċitajiet
Għadd ta 'Saffi	4-60L
Disponibbli HDI PCB Technology	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Kull saff
Ħxuna	0.3mm-6mm
Linja Minima Wisa 'u Spazju	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35mm
Daqs Min Imtaqqab bil-lejżer	0.075mm (3nil)
Daqs Min Imtaqqab mekkaniku	0.15mm (6mil)
Proporzjon tal-Aspett għal toqba tal-lejżer	0.9: 1
Proporzjon tal-Aspett għal toqba li tgħaddi	16: 1
Finish tal-wiċċ	HASL, HASL mingħajr ċomb, ENIG, Landa tal-Immersjoni, OSP, Fidda tal-Immersjoni, Saba 'Deheb, Deheb iebes bl-Electroplating, OSP ective ENEPIG.etc Selettiv.
Permezz tal-Għażla tal-Imla	Il-via huwa miksi u mimli b'epoxy konduttiv jew mhux konduttiv imbagħad mgħotti u miksi
	Ram mimli, mimli bil-fidda
	Laser permezz tar-ram magħluq
Reġistrazzjoni	± 4mil
Maskra tal-Istann	Aħdar, Aħmar, Isfar, Blu, Abjad, Iswed, Vjola, Iswed Matte, aħdar Matte eċċ.