Double sided pcb Normal pcb Lead free HASL Counterbore Manufacturer | YMS PCB
HAL(Lead Free), the full name is Hot Air leveling with Lead Free. Compared with HASL, the main difference for HAL(Lead Free) is the element of material which do not contain Lead(Pb), so it’s RoHS Compliant and it’s much more popular and widely used in manifattura tal-PCB .
HAL(Lead Free) requires higher run temperatures for lead free solder and longer contact time, the production cost for HAL(Lead Free) is slightly higher than HASL(Tin/Lead).
The manufacturing process of HAL(Lead Free) is similar to HASL(Tin/Lead), the circuit boards will be submersed in molten solder(Lead Free). This solder will cover all the exposed copper surfaces. Upon retraction from the solder, high pressure hot air is blown over the surface through air knives, this levels the solder deposit and removes the excess solder from the surface of printed circuit boards.
Introduzzjoni tal-Bord taċ-Ċirkwit Stampat
Bord ta 'ċirkwit stampat normali: Most PCBs for simple electronics are simple and composed of only a single layer. More sophisticated hardware such as computer graphics cards or motherboards can have 2 or multiple layers, sometimes up to twelve.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.
What is the difference between a Countersink and a Counterbore?
Kapaċitajiet ta 'manifattura tal-PCB normali YMS:
Ħarsa ġenerali tal-kapaċitajiet tal-manifattura tal-PCB normali YMS | ||
Karatteristika | kapaċitajiet | |
Għadd ta 'Saffi | 1-60L | |
Teknoloġija tal-PCB Normali Disponibbli | Toqba minn ġol-Aspett Proporzjon 16: 1 | |
midfun u għomja via | ||
Ibrida | Materjal ta 'Frekwenza Għolja bħal RO4350B u FR4 Mix eċċ. | |
Materjal ta 'Veloċità Għolja bħal M7NE u FR4 Mix eċċ. | ||
Materjal | CEM- | CEM-1; CEM-2 ; CEM-4 ; CEM-5.etċ |
FR4 | EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF, NP170G eċċ. | |
Veloċità għolja | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, Serje N4000-13, MW4000, MW2000, TU933 eċċ. | |
Frekwenza għolja | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 eċċ. | |
Oħrajn | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000, PEEK, PTFE, ibbażati fuq iċ-ċeramika eċċ. | |
Ħxuna | 0.3mm-8mm | |
Ħxuna tar-ram | 10OZ | |
Linja Minima Wisa 'u Spazju | 0.05mm / 0.05mm (2mil / 2mil) | |
BGA PITCH | 0.35mm | |
Daqs Min Imtaqqab mekkaniku | 0.15mm (6mil) | |
Proporzjon tal-Aspett għal toqba li tgħaddi | 16 : 1 | |
Finish tal-wiċċ | HASL, HASL mingħajr ċomb, ENIG, Landa tal-Immersjoni, OSP, Fidda tal-Immersjoni, Saba 'Deheb, Deheb iebes bl-Electroplating, OSP ective ENEPIG.etc Selettiv. | |
Permezz tal-Għażla tal-Imla | Il-via hija miksija u mimlija b'epossi konduttivi jew mhux konduttivi imbagħad mgħottija u miksija (VIPPO) | |
Ram mimli, mimli bil-fidda | ||
Reġistrazzjoni | ± 4mil | |
Maskra tal-Istann | Aħdar, Aħmar, Isfar, Blu, Abjad, Iswed, Vjola, Iswed Matte, aħdar Matte eċċ. |
Tista 'Tħobb:
1、Summary of matters needing attention in circuit board welding
3、 PCB tar- What is PCB
4、X'inhu l-ittestjar tal-bord vojt?
5. X'inhu d-disinn tal-PCB ta 'frekwenza għolja