HDI PCB 12 Layer 2 Step HDI Board | YMS PCB

Penerangan Ringkas:

HDI PCB is the short form of high-density interconnect printed circuit board, a kind of printed circuit board manufacturing technology.

An PCB HDI is a circuit board with a relatively high circuit density that uses micro-blind and buried “via”—or the copper-plated holes in PCBs—technology.

HDI PCB are compact products designed for small-capacity users, as they cost much more than standard PCB.

The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers.

For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism.

You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

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Detail produk

Soalan Lazim

produk Tags

Parameter

Lapisan: 12

Base Material:FR4 High Tg EM827

Ketebalan: 1.2 ± 0.1mm

Min.Hole Size：0.15mm

Minimum Line Width/Space：0.075mm/0.075mm

Pelepasan minimum antara Lapisan Dalam PTH dan Garis: 0.2mm

Size：101mm×55mm

Nisbah aspek: 8: 1

Rawatan permukaan: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Aplikasi: Telecommunication

What is HDI PCBs?

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the PCB HDI design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

1.multi langkah HDI membolehkan sambungan antara mana-mana lapisan;

2.Cross lapisan pemprosesan laser boleh meningkatkan tahap kualiti multi-langkah HDI;

gabungan 3. HDI dan bahan-bahan frekuensi tinggi, laminates berasaskan logam, FPC dan lain-lain laminates dan proses khas membolehkan keperluan ketumpatan yang tinggi dan kekerapan yang tinggi, penjalanan api yang tinggi, atau pemasangan 3D.

Kemudahan pembuatan YMS HDI PCB :

Gambaran keseluruhan keupayaan pembuatan YMS HDI PCB
Ciri	kemampuan
Kiraan Lapisan	4-60L
Teknologi PCB HDI yang ada	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Lapisan apa pun
Ketebalan	0.3mm-6mm
Lebar dan Ruang Garisan minimum	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35mm
Saiz Penggerudian laser Min	0.075mm (3nil)
Saiz Penggerudian Min mekanikal	0.15mm (6 juta)
Nisbah Aspek untuk lubang laser	0.9: 1
Nisbah Aspek untuk lubang melalui	16: 1
Kemasan Permukaan	HASL, HASL bebas timbal, ENIG, Timah rendaman, OSP, Perak rendaman, Jari emas, Emas keras penyaduran, OSP terpilih ， ENEPIG.etc.
Melalui Pilihan Isi	Jalur disalut dan diisi dengan epoksi konduktif atau tidak konduktif kemudian ditutup dan disalut
	Tembaga diisi, perak diisi
	Laser melalui penutup berlapis tembaga
Pendaftaran	± 4 juta
Topeng Pateri	Hijau, Merah, Kuning, Biru, Putih, Hitam, Ungu, Matte Hitam, Matte hijau.etc.