HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

लघु वर्णन:

एचडीआय मुद्रित सर्किट बोर्ड offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

घटके

स्तर: 8

Base Material:FR4 High Tg EM827

जाडी 1.6 ± 0.10mm

Min.Hole Size：0.15mm

किमान लाइन रुंदी / जागा: 0.10mm / 0.10mm

आतील स्तर पीटीएच आणि लाइन दरम्यान किमान मंजूरी mm 0.2 मिमी

आकार: 222mm × 120mm

Aspect Ratio：10.6 : 1

पृष्ठभाग उपचार: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

अनुप्रयोग: संगणक

आम्हाला ई-मेल पाठवा PDF म्हणून डाउनलोड करा

उत्पादन तपशील

नेहमी विचारले जाणारे प्रश्न

उत्पादन टॅग्ज

एचडीआय पीसीबी is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

मानव विकास मंडळ उत्पादन प्रक्रिया:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

संपूर्ण रोजी, मानव विकास प्लेट उत्पादन प्रक्रिया, क्लिष्ट आहे जे एक वेळ उत्पादन अनेक वेळा पूर्ण करणे आवश्यक आहे. तो केवळ प्रत्येक थर अचूकता आणि आकार वाढणे नियंत्रण उच्च आवश्यकता, पण साहित्य, उपकरणे, पर्यावरण आणि तांत्रिक कर्मचारी उच्च मानके आहे.

YMS HDI PCB manufacturing capabilities:

वाईएमएस एचडीआय पीसीबी उत्पादन क्षमतांचे विहंगावलोकन
वैशिष्ट्य	क्षमता
स्तर संख्या	4-60L
उपलब्ध एचडीआय पीसीबी तंत्रज्ञान	1 + एन + 1
	2 + एन + 2
	3 + एन + 3
	4 + एन + 4
	5 + एन + 5
	कोणतीही थर
जाडी	0.3 मिमी -6 मिमी
किमान रेखा रुंदी आणि जागा	0.05 मिमी / 0.05 मिमी (2 मिली / 2 मिली)
बीजीए पिच	0.35 मिमी
किमान लेसर ड्रिल आकार	0.075 मिमी (3nil)
किमान यांत्रिक ड्रिल आकार	0.15 मिमी (6 मिली)
लेसर होलसाठी आस्पेक्ट रेश्यो	0.9: 1
छिद्रातून आस्पेक्ट रेशो	16: 1
पृष्ठभाग समाप्त	एचएएसएल, लीड फ्री एचएएसएल, एनआयजी, विसर्जन टिन, ओएसपी, विसर्जन चांदी, गोल्ड फिंगर, इलेक्ट्रोप्लेटिंग हार्ड गोल्ड, सिलेक्टिव ओएसपी ， एनईपीआयजी.एटसी.
भरा पर्याय द्वारे	मार्ग प्लेटेड आणि एकतर वाहक किंवा नॉन-कंडक्टिव इपॉक्सीने भरलेला आहे नंतर कॅप्ड आणि प्लेटेड
	तांबे भरला, चांदी भरली
	तांबे प्लेटेड शट मार्गे लेझर
नोंदणी	M 4 मिल
सोल्डर मास्क	हिरवा, लाल, पिवळा, निळा, पांढरा, काळा, जांभळा, मॅट ब्लॅक, मॅट ग्रीन.एटसी.