China HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB factory and manufacturers | Yongmingsheng
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HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Товч тодорхойлолт:

HDI хэвлэмэл хэлхээний хавтан offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

параметрүүд

Давхаргууд нь: 8

Base Material:FR4 High Tg EM827

Зузаан: 1.6 ± 0.10mm

Min.Hole Size:0.15mm

Хамгийн бага Line Өргөн / Space: 0.10mm / 0.10mm

Дотоод давхаргын PTH ба шугамын хоорондох хамгийн бага зай: 0.2 мм

Хэмжээ: 222mm × 120mm

Aspect Ratio:10.6 : 1

Гадаргуугийн боловсруулалт: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Програм: Компьютерийн


Бүтээгдэхүүний дэлгэрэнгүй

тусламж

Бүтээгдэхүүний хаягууд

HDI ПХБ is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

ХХИ-ийн ТУЗ-ийн үйлдвэрлэлийн үйл явц:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Ерөнхийдөө, ХХИ хавтан үйлдвэрлэлийн үйл явц нь удаан хугацааны туршид үйлдвэрлэлийн олон удаа дараа хийж байх хэрэгтэй бөгөөд энэ нь төвөгтэй юм. Энэ нь зөвхөн давхарга бүрийн нарийвчлал болон агшилтын хяналт тавих өндөр шаардлага, бас материал, тоног төхөөрөмж, байгаль орчин, техникийн ажилтнууд өндөр стандарт юм.

HDI ПХБ

YMS HDI PCB manufacturing capabilities:

YMS HDI PCB үйлдвэрлэлийн чадварын тойм
Онцлог шинж чанар чадвар
Давхаргын тоо 4-60л
HDI PCB технологийг ашиглах боломжтой 1 + N + 1
2 + N + 2
3 + N + 3
4 + N + 4
5 + N + 5
Аливаа давхарга
Зузаан 0.3mm-6mm
Хамгийн бага мөрийн өргөн ба зай 0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH 0.35 мм
Хамгийн бага лазераар өрөмдсөн хэмжээ 0.075мм (3нил)
Хамгийн бага механик өрөмдлөгийн хэмжээ 0.15мм (6мл)
Лазерын нүхний харьцаа 0.9: 1
Нүхний харьцаа 16: 1
Гадаргуугийн өнгөлгөө HASL, хар тугалгагүй HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplate Hard Gold, Selective OSP , ENEPIG.etc.
Дүүргэх сонголтоор Дамжуулагчийг өнгөлж, дамжуулагч эсвэл дамжуулагч бус эпоксидоор дүүргээд дараа нь таглаад бүрхэнэ
Зэс дүүрсэн, мөнгө дүүрсэн
Зэсээр бүрсэн хаалттай лазер
Бүртгэл ± 4 миль
Гагнуурын маск Ногоон, улаан, шар, цэнхэр, цагаан, хар, нил ягаан, царцсан хар, царцсан ногоон гэх мэт.

YMS бүтээгдэхүүний талаар илүү ихийг олж мэдэх


https://www.ymspcb.com/8-layer-2-step-hdi-board-yms-pcb.html



  • Өмнөх:
  • Дараа нь:

  • What is HDI material?

    FR4 Fiberglass board or ceramic board

    Are printed circuit boards still used?

    Yes,the Printed circuit board(PCB) is the foundation of electronic equipment, and it can be found in every electronic device in today ’s world

    What is the major disadvantage of printed circuit boards?

    1.single use 2.environmental pollution 3.high cost

    Is there gold in printed circuit boards?

    yes,there is

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