HDI pcb tetahi papanga hdi pcb tere tere whakauruhia te ngaronga whakamatautau enepig | YMSPCB

Whakaahuatanga Poto:

HDI any-layer printed circuit boards,sometimes also called an ELIC – Every Layer Interconnect HDI, is a PCB where each layer is a microvia-based HDI layer, and all the connections between the layers are made using copper filled microvias.

tawhā

Paparanga: 12L HDI tetahi-papanga pcb

Whakaaro Poari: 1.6mm

Rauemi Papa: M7NE

Poka Min: 0.2mm

Whanui Raina Iti / Maamaa: 0.075mm / 0.075mm

Te Maamaa Iti i waenga i te Apa o Roto PTH me te Raina ： 0.2mm

Rahi: 107.61mm × 123.45mm

Ratio Wahanga ： 10: 1

Maimoatanga o te mata: ENEPIG + Mihini Koura

Motuhake: Tetahi paparanga hdi pcb, rauemi tere tere, whakakikorua koura pakeke mo nga honohono mata, whakamoemiti whakamatautau ngaro, Z-tuaka mira, Taiaho ma te parahi kapi

Tukanga Motuhake: Matotoru o maihao Gold: 12 "

Urunga rerekee 100 + 7 / -8Ω

Nga tono: Module Optical

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FAQ

Tūtohu hua

He aha te HDI PCB

Ko te HDI PCB: High density interconnect PCB, are a way of making more room on your printed circuit board to make them more efficient and allow for faster transmission. It's relatively easy for most enterprising companies that are using printed circuit boards to see how this can benefit them.

Nga painga o HDI PCB

Ko te take nui mo te whakamahi i te hangarau HDI ko te tino piki ake o te kaha tākai. Ko te waahi i whiwhihia e nga hanganga ara pai hei waatea mo nga waahanga. Ano hoki, ko nga whakaritenga o te waahi ka whakaitihia ka iti ake te rahi o te poari me te iti o nga papa.

I te nuinga o te wa e waatea ana te FPGA, te BGA ranei, me te 1mm iti ake ranei te mokowhiti. Ma te hangarau HDI e ngawari ai te nekehanga me te hononga, ina koa ka huri i waenga i nga titi.

YMS HDI PCB whakahoahoa i nga hononga capa :

YMS HDI PCB whakangao tirohanga kaha
Āhuahira	āheinga
Kaute Papa	4-60L
Kei te waatea HDI PCB Hangarau	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Tetahi paparanga
Matotoru	0.3mm-6mm
Raina Itinga Whanui me te Mokowā	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35mm
Min laser Te Rahi Rore	0.075mm (3nil)
Te miihini Min	0.15mm (6mil)
Ratio Wahanga mo te poka laser	0.9: 1
Ratio Wahanga mo te poka	16: 1
Mata Whakamutunga	HASL, Lead free HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP, ENEPIG.etc.
Ma te Kii Whakakii	Ka whakakikihia te via ka whakakiihia ki te epoxy arataki kore-arataki ranei ka kapi ka pani
	Kapi kapi, kapi hiriwa
	Taiaho ma te parahi whakakikoruatia tutakina
Rehitatanga	± 4mira
Mask Topi	Kakarariki, Whero, kowhai, Kahurangi, Ma, Mangu, Waiporoporo, Matte Pango, Matte matariki.