HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Whakaahuatanga Poto:

Nga papa taiawhio HDI offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

tawhā

Apa: 8

Base Material:FR4 High Tg EM827

Matotoru: 1.6 ± 0.10mm

Min.Hole Size：0.15mm

Mōkito Raina Whānui / Space: 0.10mm / 0.10mm

Te Maamaa Iti i waenga i te Apa o Roto PTH me te Raina ： 0.2mm

Rahi: 222mm × 120mm

Aspect Ratio：10.6 : 1

maimoatanga Mata: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Tono: Rorohiko

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Taipitopito hua

FAQ

Tūtohu hua

Ko te HDI PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

tukanga production HDI Poari:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

I runga i te katoa, he matatini te tukanga whakaputa o pereti HDI, e hiahia ana ki te kia oti i muri i maha nga wa o te hanga mo te wa roa. Ko te kore anake ngā whakaritenga tiketike mo te tika me te na'ina'iraa mana o ia paparanga, engari ano paerewa tiketike i roto i ngā rauemi, ngā taputapu, te taiao me te kaimahi hangarau.

YMS HDI PCB manufacturing capabilities:

YMS HDI PCB whakangao tirohanga kaha
Āhuahira	āheinga
Kaute Papa	4-60L
Kei te waatea HDI PCB Hangarau	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Tetahi paparanga
Matotoru	0.3mm-6mm
Raina Itinga Whanui me te Mokowā	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35mm
Min laser Te Rahi Rore	0.075mm (3nil)
Te miihini Min	0.15mm (6mil)
Ratio Wahanga mo te poka laser	0.9: 1
Ratio Wahanga mo te poka	16: 1
Mata Whakamutunga	HASL, Lead free HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP, ENEPIG.etc.
Ma te Kii Whakakii	Ka whakakikihia te via ka whakakiihia ki te epoxy arataki kore-arataki ranei ka kapi ka pani
	Kapi kapi, kapi hiriwa
	Taiaho ma te parahi whakakikoruatia tutakina
Rehitatanga	± 4mira
Mask Topi	Kakarariki, Whero, kowhai, Kahurangi, Ma, Mangu, Waiporoporo, Matte Pango, Matte matariki.