HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Famaritana fohy:

Ireo singa mifandraika amin'ny HDI offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

masontsivana

Sosona: 8

Base Material:FR4 High Tg EM827

Hateviny: 1.6 ± 0.10mm

Min.Hole Size：0.15mm

Minimum Line Sakany / Space: 0.10mm / 0.10mm

Fahazavana kely indrindra eo anelanelan'ny Layer PTH sy ny laharana ： 0.2mm

Size: 222mm × 120mm

Aspect Ratio：10.6 : 1

Ambony fitsaboana: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Applications: Computer

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Product Detail

FAQ

Tags vokatra

HDI PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI Board dingana famokarana:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Ao amin'ny rehetra, ny famokarana dingan'ny HDI lovia no sarotra, izay mila ho vita araka ny famokarana imbetsaka nandritra ny fotoana ela. Tsy avo ihany no fepetra ho an'ny marina sy ny fanaraha-maso ny tsirairay shrinkage sosona, fa koa amin'ny fitsipika ambony fitaovana, fitaovana, tontolo iainana sy ara-teknika mpiasa.

YMS HDI PCB manufacturing capabilities:

YMS HDI PCB famokarana topy maso fahaiza-manao
endri-javatra	fahaiza-manao
Isan'ny sosona	4-60L
Misy Technology HDI PCB	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Izay sosona rehetra
hateviny	0.3mm-6mm
Tsipika faran'ny ambany sy habakabaka	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35 mm
Min tamin'ny laser nohosorana habe	0.075mm (3nil)
Min mekanika namboarina habe	0.15mm (6mil)
Aspect Ratio ho an'ny lavaka laser	0,9: 1
Aspect Ratio amin'ny alàlan'ny lavaka	16: 1
Vita ny etona	HASL, HASL maimaim-poana, ENIG, firoboka ao anaty rano, OSP, volom-boaloboka, rantsantanana volamena, volamena mafy elektrika, OSP voafantina, ENEPIG.etc.
Amin'ny alàlan'ny Safidy famenoana	Ny via dia nopetahany takelaka ary nofenoina epoxy conductive na tsy conductive avy eo nopetahana sy nopetahany takelaka
	Fenoy varahina, feno volafotsy
	Laser amin'ny alàlan'ny varahina nopetahany takela
fisoratana anarana	± 4mil
Saron-tava solder	Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.