HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Īss apraksts:

HDI iespiedshēmu plates offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

Parametri

Slāņi: 8

Base Material:FR4 High Tg EM827

Biezums: 1.6 ± 0.10mm

Min.Hole Size：0.15mm

Minimālā Line Platums / Space: 0.10mm / 0.10mm

Minimālā atstarpe starp iekšējā slāņa PTH un līniju ： 0,2 mm

Izmērs: 222mm x 120mm

Aspect Ratio：10.6 : 1

Virsmas apstrāde: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Pieteikumi: Computer

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Produkta detaļas

Biežāk uzdotie jautājumi

Preces birkas

HDI PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI Board ražošanas process:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Kopumā, ražošanas process HDI plāksnes ir sarežģīta, kas ir jāpabeidz pēc daudzkārt ražošanas uz ilgu laiku. Tas ir ne tikai augstas prasības attiecībā uz precizitāti un saraušanās kontrole katras kārtas, bet arī augsti standarti materiālu, iekārtu, vidi un tehnisko personālu.

YMS HDI PCB manufacturing capabilities:

YMS HDI PCB ražošanas iespēju pārskats
Funkcija	iespējas
Slāņu skaits	4-60L
Pieejamā HDI PCB tehnoloģija	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Jebkurš slānis
Biezums	0,3 mm-6 mm
Minimālais līnijas platums un telpa	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35 mm
Min. Lāzera urbuma izmērs	0.075mm (3nil)
Minimālais mehāniskais urbuma izmērs	0,15 mm (6 mili)
Aspekta attiecība lāzera caurumam	0,9: 1
Aspekta attiecība caur caurumu	16: 1
Virsmas apdare	HASL, svina nesaturošs HASL, ENIG, iegremdējamais alvas, OSP, iegremdēšanas sudrabs, zelta pirksts, cietā zelta galvaniskais pārklājums, selektīvais OSP ， ENEPIG.etc.
Izmantojot aizpildīšanas opciju	Caurvads ir pārklāts un piepildīts ar vadošu vai nevadošu epoksīdu, pēc tam aizklāts un pārklāts
	Vara pildījums, sudraba pildījums
	Lāzers caur vara pārklājumu aizvērts
Reģistrācija	± 4mil
Lodēšanas maska	Zaļa, sarkana, dzeltena, zila, balta, melna, violeta, matēta melna, matēta zaļa utt.