Double sided pcb Normal pcb Lead free HASL Counterbore Manufacturer | YMS PCB
HAL(Lead Free), the full name is Hot Air leveling with Lead Free. Compared with HASL, the main difference for HAL(Lead Free) is the element of material which do not contain Lead(Pb), so it’s RoHS Compliant and it’s much more popular and widely used in PCB ražošanas .
HAL(Lead Free) requires higher run temperatures for lead free solder and longer contact time, the production cost for HAL(Lead Free) is slightly higher than HASL(Tin/Lead).
The manufacturing process of HAL(Lead Free) is similar to HASL(Tin/Lead), the circuit boards will be submersed in molten solder(Lead Free). This solder will cover all the exposed copper surfaces. Upon retraction from the solder, high pressure hot air is blown over the surface through air knives, this levels the solder deposit and removes the excess solder from the surface of printed circuit boards.
Ievads iespiedshēmas plates jomā
Parasta iespiedshēmas plate: Most PCBs for simple electronics are simple and composed of only a single layer. More sophisticated hardware such as computer graphics cards or motherboards can have 2 or multiple layers, sometimes up to twelve.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.
What is the difference between a Countersink and a Counterbore?
YMS parastās PCB ražošanas iespējas:
| YMS Normal PCB ražošanas iespēju pārskats | ||
| Funkcija | iespējas | |
| Slāņu skaits | 1-60 l | |
| Pieejama parastā PCB tehnoloģija | Caur caurumu ar malu attiecību 16: 1 | |
| aprakts un akls via | ||
| Hibrīds | Augstas frekvences materiāli, piemēram, RO4350B un FR4 Mix utt. | |
| Ātrgaitas materiāls, piemēram, M7NE un FR4 Mix utt. | ||
| Materiāls | CEM- | CEM-1; CEM-2, CEM-4, CEM-5.etc |
| FR4 | EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF, NP170G utt. | |
| Liels ātrums | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 sērija, MW4000, MW2000, TU933 utt. | |
| Augsta frekvence | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 utt. | |
| Citi | Poliimīds, Tk, LCP, BT, C slānis, Fradflex, Omega, ZBC2000, PEEK, PTFE, uz keramikas bāzes utt. | |
| Biezums | 0,3 mm - 8 mm | |
| Maks. Vara biezums | 10 oz | |
| Minimālais līnijas platums un telpa | 0.05mm / 0.05mm (2mil / 2mil) | |
| BGA PITCH | 0,35 mm | |
| Minimālais mehāniskais urbuma izmērs | 0,15 mm (6 mili) | |
| Aspekta attiecība caur caurumu | 16 ： 1 | |
| Virsmas apdare | HASL, svina nesaturošs HASL, ENIG, iegremdējamais alvas, OSP, iegremdēšanas sudrabs, zelta pirksts, cietā zelta galvaniskais pārklājums, selektīvais OSP ， ENEPIG.etc. | |
| Izmantojot aizpildīšanas opciju | Caurlaidība ir pārklāta un piepildīta ar vadošu vai nevadošu epoksīdu, pēc tam aizklāta un pārklāta (VIPPO) | |
| Vara pildījums, sudraba pildījums | ||
| Reģistrācija | ± 4mil | |
| Lodēšanas maska | Zaļa, sarkana, dzeltena, zila, balta, melna, violeta, matēta melna, matēta zaļa utt. | |
Jums var patikt:
1、Summary of matters needing attention in circuit board welding
3 、What is PCB
4、Kas ir tukša dēļa testēšana?
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