HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Trumpas aprašymas:

HDI spausdintinės plokštės offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

parametrai

Sluoksniai: 8

Base Material:FR4 High Tg EM827

Storis: 1,6 ± 0.10mm

Min.Hole Size：0.15mm

Minimalus linijos plotis / Erdvė: 0.10mm / 0.10mm

Mažiausias atstumas tarp vidinio sluoksnio PTH ir linijos ： 0,2 mm

Dydis: 222mm x 120mm

Aspect Ratio：10.6 : 1

Paviršiaus apdirbimas: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Programos: kompiuterių

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Prekės detalės

DUK

Prekės žymės

HDI PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI plokščių gamybos procesas:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Apskritai, gamybos procesas HDI plokštės yra sudėtingas, kuris turi būti baigtas po daug kartų gamybos ilgą laiką. Tai ne tik aukštus reikalavimus tikslumas ir susitraukimas kontrolės kiekvieno sluoksnio, bet ir aukšti standartai medžiagų, įrangos, aplinkos ir techninio personalo.

YMS HDI PCB manufacturing capabilities:

YMS HDI PCB gamybos galimybių apžvalga
Funkcija	galimybes
Sluoksnių skaičius	4-60L
Galima HDI PCB technologija	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Bet koks sluoksnis
Storis	0,3 mm - 6 mm
Mažiausias linijos plotis ir erdvė	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35 mm
Min. Išgręžtas lazeriu dydis	0,075 mm (3 nuliai)
Min. Mechaninis išgręžtas dydis	0,15 mm (6 mln.)
Lazerio skylės proporcija	0.9: 1
Kiaurymės proporcija	16: 1
Paviršiaus apdaila	HASL, be švino HASL, ENIG, panardinimo skarda, OSP, panardinamasis sidabras, auksinis pirštas, galvanizuotas kietasis auksas, selektyvusis OSP ， ENEPIG.etc.
Per užpildymo parinktį	Viadas yra padengtas ir užpildytas laidžiu arba nelaidžiu epoksidu, tada uždengiamas ir padengiamas
	Vario užpildas, sidabro užpildymas
	Lazeris uždengtas variu
Registracija	± 4mil
Lydmetalio kaukė	Žalia, raudona, geltona, mėlyna, balta, juoda, violetinė, matinė juoda, matinė žalia. Ir kt.