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Low MOQ for Black Printed Circuit Boards - High TG FR4 Material PCB BGA Pitch 0.65mm| YMS PCB – Yongmingsheng

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Our mission is to become an innovative supplier of high-tech digital and communication devices by providing value added design, world-class manufacturing, and service capabilities for Sensor Printed Circuit Board, Hdi Rigid-Flex Pcb, Single Sided Metal Core Pcb, In order to expand our international market, we mainly supply our oversea customers Top quality performance products and service.
Low MOQ for Black Printed Circuit Boards - High TG FR4 Material PCB BGA Pitch 0.65mm| YMS PCB – Yongmingsheng Detail:

High-TG PCB Advanced Circuits Specification

The glass transition temperature of PCB, referred to as “Tg”, indicates the point at which the PCB material will begin to transform. If the operating temperature exceeds the designated Tg value, the board will begin to change from a solid to a liquid state, which is likely to have an adverse effect on its ability to function.

Standard PCBs are manufactured with materials offering a TG value of 140°C, which can withstand an operating temperate of 110°C. While this may not be suitable for extreme-temperature processes that are commonplace in applications such as automotive, industrial or high-temperature electronics. In these situations, a PCB made from FR-4 High TG material can often provide the best solution.

High TG material-selection

YMS High Tg PCB manufacturing capabilities:

YMS High Tg PCB manufacturing capabilities overview

Feature capabilities
Layer Count 3-60L
Available Multilayer PCB Technology Through hole with Aspect Ratio 16:1
buried and blind via
Hybrid High Frequency Material such as RO4350B and FR4 TG 180°Mix  etc.
High Speed Material such as M7NE and FR4 TG 180°Mix   etc.
Thickness 0.3mm-8mm
Minimum line Width and Space 0.05mm/0.05mm(2mil/2mil)
BGA  PITCH 0.35mm
Min mechanical Drilled Size 0.15mm(6mil)
Aspect Ratio for through hole 16:1
Surface Finish HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP,ENEPIG.etc.
Via Fill Option The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over(VIPPO)
Copper filled, silver filled
Registration ±4mil
Solder Mask Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc.

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Low MOQ for Black Printed Circuit Boards - High TG FR4 Material PCB BGA Pitch 0.65mm| YMS PCB – Yongmingsheng detail pictures

Low MOQ for Black Printed Circuit Boards - High TG FR4 Material PCB BGA Pitch 0.65mm| YMS PCB – Yongmingsheng detail pictures


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We keep on with our business spirit of "Quality, Performance, Innovation and Integrity". We goal to create much more worth for our customers with our rich resources, state-of-the-art machinery, experienced workers and exceptional providers for Low MOQ for Black Printed Circuit Boards - High TG FR4 Material PCB BGA Pitch 0.65mm| YMS PCB – Yongmingsheng , The product will supply to all over the world, such as: Greece, San Diego, Lyon, In order to carry out our goal of "customer first and mutual benefit" in the cooperation, we establish a specialist engineering team and a sales team to supply the best service to satisfy our customers' requirements. Welcome you to cooperate with us and join us. We have been your best choice.
  • Hope that the company could stick to the enterprise spirit of "Quality, Efficiency, Innovation and Integrity", it will be better and better in the future.
    5 Stars By Delia from France - 2018.12.25 12:43
    The company's products can meet our diverse needs, and the price is cheap, the most important is that the quality is also very nice.
    5 Stars By Victoria from Bangalore - 2017.11.12 12:31
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