HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

ລາຍລະອຽດສັ້ນ:

ແຜ່ນວົງຈອນພິມ HDI offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

ພາລາມິເຕີ

ຊັ້ນ: 8

Base Material:FR4 High Tg EM827

ຄວາມຫນາ: 16 ± 010 ເດືອນ

Min.Hole Size：0.15mm

ຂັ້ນຕ່ໍາ Width Line / Space: 010 ເດືອນ / 010 ເດືອນ

ການລ້າງຂັ້ນຕ່ ຳ ລະຫວ່າງຊັ້ນໃນ PTH ແລະສາຍ： 0.2mm

ຂະຫນາດ: 222mm × 120mm

Aspect Ratio：10.6 : 1

ການປິ່ນປົວດ້ານ: ຍອມຮັບ

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

ຄໍາຮ້ອງສະຫມັກ: ຄອມພິວເຕີ

ສົ່ງອີເມລ໌ໃຫ້ພວກເຮົາ ດາວໂຫລດເປັນ PDF

ລາຍລະອຽດຜະລິດຕະພັນ

ຄຳ ຖາມທີ່ຖາມ

Tags ຜະລິດຕະພັນ

PCB HDI is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

ຂະບວນການຜະລິດ HDI Board:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

ໃນທັງຫມົດ, ຂະບວນການຜະລິດຂອງແຜ່ນ HDI ແມ່ນສະລັບສັບຊ້ອນ, ຊຶ່ງຕ້ອງການທີ່ຈະໄດ້ຮັບການສໍາເລັດຫຼັງຈາກຈໍານວນຫຼາຍເວລາຂອງການຜະລິດສໍາລັບການໃຊ້ເວລາດົນນານ. ມັນບໍ່ພຽງແຕ່ຄວາມຕ້ອງການສູງສໍາລັບຄວາມຖືກຕ້ອງແລະການຫົດຕົວຄວບຄຸມຂອງແຕ່ລະຊັ້ນ, ແຕ່ຍັງມາດຕະຖານສູງໃນອຸປະກອນ, ອຸປະກອນ, ສະພາບແວດລ້ອມແລະບຸກຄະລາກອນດ້ານວິຊາການ.

YMS HDI PCB manufacturing capabilities:

ພາບລວມຄວາມສາມາດໃນການຜະລິດ YMS HDI PCB
ຄຸນນະສົມບັດ	ຄວາມສາມາດ
ຈຳ ນວນຊັ້ນ	4-60L
ມີ HDI PCB Technology	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	ຊັ້ນໃດ
ຄວາມ ໜາ	ຂະ ໜາດ 0.3mm-6mm
ເສັ້ນຄວາມກວ້າງແລະຊ່ອງນ້ອຍສຸດ	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	ຂະ ໜາດ 0.35mm
ຂະ ໜາດ ເຈາະເລເຊີຂະ ໜາດ ນ້ອຍ	0.075mm (3nil)
ຂະ ໜາດ ເຈາະກົນຈັກ ໜ້ອຍ	0.15mm (6mil)
ອັດຕາສ່ວນຂອງ Aspect ສຳ ລັບຮູເລເຊີ	0.9: 1, ລ. ມ
ອັດຕາສ່ວນ ສຳ ລັບຜ່ານຮູ	16: 1, ລ. ມ
ດ້ານ ສຳ ເລັດຮູບ	HASL, Lead free HASL, ENIG, Immersion Tin, OSP, ເງິນດູດຊຶມ, ນິ້ວມື ຄຳ, Electroplating ຄຳ ແຂງ, ຄຳ ທີ່ເລືອກ OSP， ENEPIG.etc
ຜ່ານ Option Option	ທາງຜ່ານແມ່ນຖືກຈັດໃສ່ແລະເຕັມໄປດ້ວຍ epoxy ທີ່ບໍ່ສາມາດປະຕິບັດໄດ້ຫຼືບໍ່ແມ່ນການປະພຶດ
	ທອງແດງທີ່ເຕັມໄປ, ເງິນເຕັມໄປ
	ເລເຊີຜ່ານສາຍທອງແດງທີ່ປິດ
ການລົງທະບຽນ	± 4mil
ຫນ້າກາກ Solder	ສີຂຽວ, ສີແດງ, ສີເຫຼືອງ, ສີຟ້າ, ສີຂາວ, ສີ ດຳ, ສີມ່ວງ, ສີດໍາ Matte, Matte green.etc.