High Tg material PCB 6 Layer High Tg Board| YMS PCB

Kuerz Beschreiwung:

High TG PCBs have an array of applications, from engines to industrial processes, WiFi boosters, and computer systems. They mitigate the internal damage a machine does to itself when it functions by raising the tolerance of a device to heat, moisture, and chemical corrosion. Not only do they improve functionality, but they also enhance the lifespan of PCBs in general by reducing common issues like short-circuiting. If you are looking to get the best-embedded systems or a high TG PCB Fabrikant beschwéiert , look no further. You can use YMS technology to design your high TG PCB boards.

Parameteren

Layers: 6L High Tg FR4 Material Board Thinkness: 1,6 mm Base Material:EM827 High tg Min Lächer: 0.2mm Minimum Linn Breet / Clearance ： 0.075mm / 0.075mm Mindest Clearance tëscht banneschter Schicht PTH bis Linn ： 0.2mm Size：214mm×148mm Aspekt Verhältnis: 8: 1 Uewerfläch Behandlung: ENIG Single-sided impedance 55Ω±10%, Differential impedance 100+7/-8Ω Applications: Consumer electronics

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High-TG PCB Advanced Circuits Specification

The glass transition temperature of PCB, referred to as "Tg", indicates the point at which the PCB material will begin to transform. If the operating temperature exceeds the designated Tg value, the board will begin to change from a solid to a liquid state, which is likely to have an adverse effect on its ability to function.

Standard PCBs are manufactured with materials offering a TG value of 140°C, which can withstand an operating temperate of 110°C. While this may not be suitable for extreme-temperature processes that are commonplace in applications such as automotive, industrial or high-temperature electronics. In these situations, a PCB made from FR-4 High TG material can often provide the best solution.

YMS High Tg PCB manufacturing capabilities:

YMS High Tg PCB manufacturing capabilities overview
Fonktioun	Fäegkeeten
Schicht Grof	3-60L
Verfügbar Multilayer PCB Technologie	Duerch Lach mat Aspekt Verhältnis 16: 1
	begruewen a blann via
	Hybrid	High Frequency Material such as RO4350B and FR4 TG 180°Mix etc.
		High Speed Material such as M7NE and FR4 TG 180°Mix etc.
Déck	0,3 mm-8 mm
Minimum Linn Breet a Weltraum	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35mm
Min mechanesch Boormooss	0.15mm (6mil)
Aspekt Verhältnis fir duerch Lach	16: 1
Uewerfläch fäerdeg	HASL, Bläifräien HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Galvaniséierung Hard Gold, Selektiv OSP ， ENEPIG.etc.
Iwwer Fill Optioun	De via gëtt plated a mat entweder leitend oder net-leitend Epoxy gefëllt, duerno ofgedeckt a plated (VIPPO)
	Kupfer gefëllt, sëlwer gefëllt
Umeldung	± 4mil
Solder Mask	Gréng, Rout, Giel, Blo, Wäiss, Schwaarz, Purpur, Matt Schwaarz, Matt Gréng.