High Tg PCB Advanced PCB Manufacturing| YMS PCB
How do I classify high-TG materials?
material | TG | MOT |
FR4-standard-TG | 130°C | 110°C |
FR4-mittel-TG | 150°C | 130°C |
FR4-hoch-TG | 170°C | 150°C |
Polyimid-Super-hoch-TG-Material | 250°C | 230°C |
ome common high-frequency materials do not mention TGs in their datasheets. This is due to the original meaning of TG: "temperature of glass transition". Many ceramics- or PTFE-based materials do simply not contain any glass fibres and therefore have no technical TG. Generally, this fact also applies to Polyimides (PI). However, you can usually assume a TG of at least 200°C for Polyimide, ceramics or PTFE-materials. In this case the TG simply stands for temperature resistance.
You may apply the following values:
Material type | Typical „TG“ |
CEM1 | 110-130°C |
FR4 | 120-180°C |
PTFE | 200-260°C |
Ceramic | 200-300°C |
Polyimide | 200-350°C |
YMS High Tg PCB manufacturing capabilities:
YMS High Tg PCB manufacturing capabilities overview |
||
feature | facultatem | |
stratum comitis | 3-60L | |
Available multilayer PCB Technology | Et per foraminis Aspect Ratio XVI: I | |
et per buried cæcus | ||
hybrid | High Frequency Material such as RO4350B and FR4 TG 180°Mix etc. | |
High Speed Material such as M7NE and FR4 TG 180°Mix etc. | ||
crassitudine | 0.3mm, 8mm | |
Vivamus ipsum aciem spatium minimum | 0.05mm / 0.05mm (2mil / 2mil) | |
BGA CASTRA | 0.35mm | |
Min Location mechanica Drilled | 0.15mm (6mil) | |
Aspect Ratio enim per foraminis | XVI: I | |
Conclusio superficiem | Removerit, removerit Category: enig, immersionis Stannum OSP immersionis argenti Digitus Aurum, Aurum Puer electroplating, electionem selectivam OSP ENEPIG.etc. | |
Via Bene Reple | Et per hoc in patella repleti PROLIXUS vel epoxy erit PROLIXUS vel non-capped et super patella (VIPPO) | |
Aere impleta implebitur pecunia | ||
Registration | ± 4mil | |
Os solidaturam | Viridis, Red, Yellow, cæruleus, albus, Nigrum, Purple, Matte Nigrum, Matte green.etc. |
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