HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Кыска Description:

HDI басма схемалары offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

параметрлер

Layers: 8

Base Material:FR4 High Tg EM827

Thickness: 1.6 ± 0.10mm

Min.Hole Size：0.15mm

Минималдуу Line Ширина / Space: 0.10mm / 0.10mm

Ички катмар PTH менен Line ортосундагы минималдуу боштук: 0.2mm

Көлөм: 222mm × 120mm

Aspect Ratio：10.6 : 1

Surface дарылоо: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Тиркемелер: Компүтер

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Продукт Толугураак

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Продукт Tags

HDI PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

АӨИ Board иштеп чыгуу:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Бътъндёй алганда, АӨИ белгисин иштеп чыгуу узак убакыт бою өндүрүш көп эсе кийин аяктады керек бул, татаал болуп саналат. Бул ар бир катмарынын тактык жана азайышы контролдоо үчүн гана жогорку талаптар эмес, бирок ошондой эле материалдардын жогорку стандарттарды, жабдууларды, айлана-чөйрөнү коргоо жана техникалык персоналды.

YMS HDI PCB manufacturing capabilities:

YMS HDI PCB өндүрүштүк мүмкүнчүлүктөрүнө сереп
Өзгөчөлүгү	мүмкүнчүлүктөр
Катмарлардын саны	4-60L
HDI PCB технологиясы жеткиликтүү	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Каалаган катмар
Калыңдыгы	0.3mm-6mm
Минималдуу сызык Туурасы жана Боштук	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35мм
Минималдуу лазер менен бургуланган Өлчөм	0,075мм (3нил)
Минималдуу бургуланган Өлчөм	0,15мм (6мл)
Лазердик тешиктин катышы	0.9: 1
Тешиктин катышы	16: 1
Беттик бүтүрүү	HASL, Коргошунсуз HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP ， ENEPIG.etc.
Толтуруу Варианты аркылуу	Аркылуу капталган жана өткөргүч же электр өткөрбөөчү эпоксид менен толтурулган, андан кийин капкак менен капталган
	Жез толтурулган, күмүш толтурулган
	Лазер жез менен капталган
Каттоо	± 4мил
Solder Mask	Жашыл, кызыл, сары, көк, ак, кара, кызгылт көк, күңүрт кара, жалтырабаган жашыл.т.б.