Double sided pcb Normal pcb Lead free HASL Counterbore Manufacturer | YMS PCB
HAL(Lead Free), the full name is Hot Air leveling with Lead Free. Compared with HASL, the main difference for HAL(Lead Free) is the element of material which do not contain Lead(Pb), so it’s RoHS Compliant and it’s much more popular and widely used in PCB өндүрүш .
HAL(Lead Free) requires higher run temperatures for lead free solder and longer contact time, the production cost for HAL(Lead Free) is slightly higher than HASL(Tin/Lead).
The manufacturing process of HAL(Lead Free) is similar to HASL(Tin/Lead), the circuit boards will be submersed in molten solder(Lead Free). This solder will cover all the exposed copper surfaces. Upon retraction from the solder, high pressure hot air is blown over the surface through air knives, this levels the solder deposit and removes the excess solder from the surface of printed circuit boards.
Printed Circuit Board Киришүү
Кадимки басма схемасы: Most PCBs for simple electronics are simple and composed of only a single layer. More sophisticated hardware such as computer graphics cards or motherboards can have 2 or multiple layers, sometimes up to twelve.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.
What is the difference between a Countersink and a Counterbore?
YMS Кадимки PCB өндүрүү мүмкүнчүлүктөрү:
YMS Нормалдуу PCB өндүрүштүк мүмкүнчүлүктөрүнө сереп | ||
Өзгөчөлүгү | мүмкүнчүлүктөр | |
Катмарлардын саны | 1-60л | |
Кадимки PCB технологиясы бар | 16: 1 катышы менен тешик аркылуу | |
көмүлгөн жана сокурлар аркылуу | ||
Гибрид | RO4350B жана FR4 Mix сыяктуу жогорку жыштыктагы материалдар. | |
M7NE жана FR4 Mix сыяктуу жогорку ылдамдыктагы материалдар ж.б. | ||
Материал | CEM- | CEM-1; CEM-2, CEM-4 ; CEM-5. ж.б. |
FR4 | EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF, NP170G ж.б. | |
Жогорку ылдамдык | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 Series, MW4000, MW2000, TU933 ж.б. | |
Жогорку Frequency | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 ж.б. | |
Башкалар | Полимид, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000, PEEK, PTFE, керамикалык негизде ж.б. | |
Калыңдыгы | 0.3мм-8мм | |
Жездин калыңдыгы | 10OZ | |
Минималдуу сызык Туурасы жана Боштук | 0.05mm / 0.05mm (2mil / 2mil) | |
BGA PITCH | 0.35мм | |
Минималдуу бургуланган Өлчөм | 0,15мм (6мл) | |
Тешиктин катышы | 16 : 1 | |
Беттик бүтүрүү | HASL, Коргошунсуз HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP , ENEPIG.etc. | |
Толтуруу Варианты аркылуу | Аркылуу капталган жана өткөргүч же электр өткөрбөгөн эпоксид менен толтурулган, андан кийин капкак менен капталган (VIPPO) | |
Жез толтурулган, күмүш толтурулган | ||
Каттоо | ± 4мил | |
Solder Mask | Жашыл, кызыл, сары, көк, ак, кара, кызгылт көк, күңүрт кара, жалтырабаган жашыл.т.б. |
Сизге жагышы мүмкүн:
1, Summary of matters needing attention in circuit board welding
3, What is PCB
4、Жылаңач тактайды сыноо деген эмне?
5. Жогорку жыштык PCB дизайн деген эмне