HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB
HDI PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.
HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.
HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.
HDI 보드 생산 공정 :
At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.
전반적으로, HDI 판의 생산 과정은 오랜 시간 동안 생산의 많은 시간 후에 완료 될 필요가있는 복잡하다. 그것은뿐만 아니라 각 층의 정확성과 수축 제어에 대한 높은 요구 사항뿐만 아니라, 재료, 장비, 환경 및 기술 인력의 높은 수준입니다.
YMS HDI PCB manufacturing capabilities:
| YMS HDI PCB 제조 기능 개요 | |
| 특색 | 능력 |
| 레이어 수 | 4-60L |
| 사용 가능한 HDI PCB 기술 | 1 + N + 1 |
| 2 + N + 2 | |
| 3 + N + 3 | |
| 4 + N + 4 | |
| 5 + N + 5 | |
| 모든 레이어 | |
| 두께 | 0.3mm-6mm |
| 최소 라인 너비 및 공간 | 0.05mm / 0.05mm (2mil / 2mil) |
| BGA 피치 | 0.35mm |
| 최소 레이저 드릴 크기 | 0.075mm (3 무) |
| 최소 기계 드릴 크기 | 0.15mm (6mil) |
| 레이저 홀의 종횡비 | 0.9 : 1 |
| 관통 구멍의 종횡비 | 16 : 1 |
| 표면 마감 | HASL, 무연 HASL, ENIG, 침지 주석, OSP, 침수은, 금 핑거, 전기 도금 하드 금, 선택적 OSP, ENEPIG.etc. |
| 채우기 옵션을 통해 | 비아는 전도성 또는 비전 도성 에폭시로 도금되고 채워진 다음 캡핑되고 위에 도금됩니다. |
| 구리 충전,은 충전 | |
| 구리 도금 차단을 통한 레이저 | |
| 기재 | ± 4mil |
| 솔더 마스크 | 녹색, 빨간색, 노란색, 파란색, 흰색, 검은 색, 보라색, 무광택 검정색, 무광택 녹색 등. |
YMS 제품에 대해 자세히 알아보기
What is HDI material?
FR4 Fiberglass board or ceramic board
Are printed circuit boards still used?
Yes,the Printed circuit board(PCB) is the foundation of electronic equipment, and it can be found in every electronic device in today ’s world
What is the major disadvantage of printed circuit boards?
1.single use 2.environmental pollution 3.high cost
Is there gold in printed circuit boards?
yes，there is
