Double sided pcb Normal pcb Lead free HASL Counterbore Manufacturer | YMS PCB
HAL(Lead Free), the full name is Hot Air leveling with Lead Free. Compared with HASL, the main difference for HAL(Lead Free) is the element of material which do not contain Lead(Pb), so it’s RoHS Compliant and it’s much more popular and widely used in PCB 제조 .
HAL(Lead Free) requires higher run temperatures for lead free solder and longer contact time, the production cost for HAL(Lead Free) is slightly higher than HASL(Tin/Lead).
The manufacturing process of HAL(Lead Free) is similar to HASL(Tin/Lead), the circuit boards will be submersed in molten solder(Lead Free). This solder will cover all the exposed copper surfaces. Upon retraction from the solder, high pressure hot air is blown over the surface through air knives, this levels the solder deposit and removes the excess solder from the surface of printed circuit boards.
인쇄 회로 기판 소개
일반 인쇄 회로 기판: Most PCBs for simple electronics are simple and composed of only a single layer. More sophisticated hardware such as computer graphics cards or motherboards can have 2 or multiple layers, sometimes up to twelve.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.
What is the difference between a Countersink and a Counterbore?
YMS 일반 PCB 제조 기능 :
| YMS 일반 PCB 제조 기능 개요 | ||
| 특색 | 능력 | |
| 레이어 수 | 1-60L | |
| 사용 가능한 일반 PCB 기술 | 가로 세로 비율 16 : 1의 스루 홀 | |
| 매장 및 장님을 통해 | ||
| 잡종 | RO4350B 및 FR4 믹스 등과 같은 고주파 재료 | |
| M7NE 및 FR4 Mix 등과 같은 고속 소재 | ||
| 재료 | CEM- | CEM-1, CEM-2, CEM-4, CEM-5.etc |
| FR4 | EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF, NP170G 등 | |
| 고속 | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 시리즈, MW4000, MW2000, TU933 등 | |
| 고주파 | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 등 | |
| 기타 | 폴리이 미드, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000, PEEK, PTFE, 세라믹 기반 등 | |
| 두께 | 0.3mm-8mm | |
| Max.copper 두께 | 10 온스 | |
| 최소 라인 너비 및 공간 | 0.05mm / 0.05mm (2mil / 2mil) | |
| BGA 피치 | 0.35mm | |
| 최소 기계 드릴 크기 | 0.15mm (6mil) | |
| 관통 구멍의 종횡비 | 16 ： 1 | |
| 표면 마감 | HASL, 무연 HASL, ENIG, 침지 주석, OSP, 침수은, 금 핑거, 전기 도금 하드 금, 선택적 OSP, ENEPIG.etc. | |
| 채우기 옵션을 통해 | 비아는 전도성 또는 비전 도성 에폭시로 도금되고 채워진 다음 캡핑되고 위에 도금됩니다 (VIPPO) | |
| 구리 충전,은 충전 | ||
| 기재 | ± 4mil | |
| 솔더 마스크 | 녹색, 빨간색, 노란색, 파란색, 흰색, 검은 색, 보라색, 무광택 검정색, 무광택 녹색 등. | |
당신은 좋아할 수 있습니다 :
1, Summary of matters needing attention in circuit board welding
3, What is PCB
5. 고주파 PCB 설계란?
YMS 제품에 대해 자세히 알아보기
