HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Katrangan singkat:

Papan sirkuit dicithak HDI offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

paramèter

Lapisan: 8

Base Material:FR4 High Tg EM827

Kekandelan: 1.6 ± 0.10mm

Min.Hole Size：0.15mm

Minimal Line Jembar / Space: 0.10mm / 0.10mm

Reresik Minimal antarane Inner Layer PTH lan Line ： 0.2mm

Size: 222mm × 120mm

Aspect Ratio：10.6 : 1

perawatan lumahing: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Aplikasi: Komputer

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Detail produk

FAQ

Tags Product

PCB HDI Kab is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

proses produksi IPM Board:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Ing kabèh, proses produksi plate IPM punika Komplek, kang perlu kanggo bakal rampung sawisé kakehan saka produksi kanggo dangu. Iku ora mung syarat dhuwur kanggo akurasi lan shrinkage kontrol saben lapisan, nanging uga dhuwur standar ing bahan, peralatan, lingkungan lan tenaga teknis.

YMS HDI PCB manufacturing capabilities:

Ringkesan kabisan pabrik YMS HDI PCB
Fitur	kapabilitas
Count Layer	4-60L
Kasedhiya Teknologi PCB HDI	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Lapisan apa wae
Kandel	0.3mm-6mm
Jembar lan Spasi baris minimal	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35mm
Ukuran Bor Min laser	0.075mm (3nil)
Ukuran Bor Min mekanis	0.15mm (6mil)
Aspek Rasio kanggo bolongan laser	0,9: 1
Rasio Aspek liwat bolongan	16: 1
Lumahing Rampung	HASL, HASL, timah gratis, ENG, Timah, OSP, Silver Immersion, Driji Emas, Gold Hard Electroplating, OSP Selektif, ENEPIG.etc.
Liwat Isi Isi	Via dilapisi lan diisi epoxy konduktif utawa non-konduktif banjur ditutup lan dilapis
	Isi tembaga, perak isi
	Laser liwat tembaga dilapisi mati
Registrasi	± 4mil
Topeng Solder	Ijo, Abang, Kuning, Biru, Putih, Ireng, Ungu, Matte Ireng, Matte ijo.