High Tg material PCB 6 Layer High Tg Board| YMS PCB

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High TG PCBs have an array of applications, from engines to industrial processes, WiFi boosters, and computer systems. They mitigate the internal damage a machine does to itself when it functions by raising the tolerance of a device to heat, moisture, and chemical corrosion. Not only do they improve functionality, but they also enhance the lifespan of PCBs in general by reducing common issues like short-circuiting. If you are looking to get the best-embedded systems or a high TG Produsèn PCB , look no further. You can use YMS technology to design your high TG PCB boards.

paramèter

Layers: 6L High Tg FR4 Material Pikiran Papan: 1.6mm Base Material:EM827 High tg Bolongan Min: 0,2mm Jembar / reresik garis minimal: 0,075mm / 0,075mm Reresik Minimal ing antarane Lapisan Inner PTH nganti Line ： 0,2mm Size：214mm×148mm Aspek: 8: 1 perawatan lumahing: ENIG Single-sided impedance 55Ω±10%, Differential impedance 100+7/-8Ω Applications: Consumer electronics

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High-TG PCB Advanced Circuits Specification

The glass transition temperature of PCB, referred to as "Tg", indicates the point at which the PCB material will begin to transform. If the operating temperature exceeds the designated Tg value, the board will begin to change from a solid to a liquid state, which is likely to have an adverse effect on its ability to function.

Standard PCBs are manufactured with materials offering a TG value of 140°C, which can withstand an operating temperate of 110°C. While this may not be suitable for extreme-temperature processes that are commonplace in applications such as automotive, industrial or high-temperature electronics. In these situations, a PCB made from FR-4 High TG material can often provide the best solution.

YMS High Tg PCB manufacturing capabilities:

YMS High Tg PCB manufacturing capabilities overview
Fitur	kapabilitas
Count Layer	3-60L
Kasedhiya Teknologi PCB Multilayer	Liwat bolongan kanthi Aspek Rasio 16: 1
	dikubur lan wuta liwat
	Hibrida	High Frequency Material such as RO4350B and FR4 TG 180°Mix etc.
		High Speed Material such as M7NE and FR4 TG 180°Mix etc.
Kandel	0.3mm-8mm
Jembar lan Spasi baris minimal	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35mm
Ukuran Bor Min mekanis	0.15mm (6mil)
Rasio Aspek liwat bolongan	16: 1
Lumahing Rampung	HASL, HASL, timah gratis, ENG, Timah, OSP, Silver Immersion, Driji Emas, Gold Hard Electroplating, OSP Selektif, ENEPIG.etc.
Liwat Isi Isi	Via dilapisi lan diisi epoxy konduktif utawa non-konduktif banjur ditutup lan dilapisi (VIPPO)
	Isi tembaga, perak isi
Registrasi	± 4mil
Topeng Solder	Ijo, Abang, Kuning, Biru, Putih, Ireng, Ungu, Matte Ireng, Matte ijo.