Metal clad pcb 1 Layer Thermoelectric Copper base Board| YMSPCB

Short Description:

Metal clad PCBs also called MCPCBs, whose substrate layer is a metal base. The most common metals of MCPCBs used are aluminum, copper, and steel alloy. Aluminum-clad PCBs are the most cost-effective; they exist good heat conductivity and thermal dissipation ability at low prices. Copper-based PCBs perform better than aluminum, but the price is higher. Steel-based PCBs are harder than the first two materials, while with a lower heat conductivity. Metal PCBs are known as their excellent thermal dissipation.

A simple layer single sided Metal Core PCB consists of a metal base (usually aluminum, or copper alloy), Dielectric (non-conducting) Layer, Copper Circuit Layer, IC components and solder mask.

Send email to us Download as PDF

Product Detail

Product Tags

YMS offers all the types of metal clad PCBs, and just contact us if you need thicker or thinner substrates. YMS will always keep our capabilities and equipment standards with the pace of advanced levels to provide customers with the best services of PCB prototype, PCB fabrication!

Parameters

Layers: 1
Thickness：2.0±0.15mm
Base Material:copper alloy
Min.Hole Size：0.5mm
Minimum Line Width/Space：0.5mm/0.5mm
Size：108mm×58mm
Thermal Conductivity:4.0 W/mk
Glass transition temperature: 170°C
Surface treatment：Lead Free HASL
Characteristics: High thermal conductivity
Applications:LED

Copper base Board production process

Provide the copper plate have pretreated
UV ink is printed on the bending part of copper plate
The surface of copper plate is browned by using browning liquid
Press and drill copper plate covered with UV ink
Electroplate the first finished product
Make outer layer on copper plate
Solder mask printing on copper substrate
V – CUT the second finished product
The bending position of copper plate is surface treated and the finished product is obtained
Check up case ,packing and shipping

YMS copper based PCB manufacturing capabilities:

YMS copper based PCB manufacturing capabilities overview
Feature	capabilities
Layer Count	1-4L
Thermal Conductivity(w/m.k)	Aluminum PCB:0.8-10
	Copper PCB:2.0-398
Board Thickness	0.4mm-5.0mm
copper Thickness	0.5-10OZ
Minimum line Width and Space	0.1mm/0.1mm(4mil/4mil)
Speciality	Countersink,Counterbore drilling.etc.
Types of Aluminum Substrates	1000 series;5000 series;6000 series,3000 series.etc.
Min mechanical Drilled Size	0.2mm(8mil)
Surface Finish	HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP，ENEPIG.etc.
Solder Mask	Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc.