HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Stutt lýsing:

HDI prentplötur offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

færibreytur

Layers: 8

Base Material:FR4 High Tg EM827

Þykkt: 1,6 ± 0.10mm

Min.Hole Size：0.15mm

Lágmark Line Width / Bílskúr: 0.10mm / 0.10mm

Lágmarksúthreinsun milli innra lags PTH og línu ： 0,2 mm

Stærð: 222mm × 120mm

Aspect Ratio：10.6 : 1

Yfirborðsmeðferð: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Umsóknir: Tölva

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Vara Tags

HDI PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI Board framleiðsluferli:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Á heildina litið, framleiðsluferli HDI disk er flókið, sem þarf að vera lokið eftir margra tímum framleiðslu í langan tíma. Það er ekki bara hár kröfur um nákvæmni og rýrnun stjórn hvert lag, en einnig miklar kröfur í efni, tæki, umhverfi og tæknisviði.

YMS HDI PCB manufacturing capabilities:

YMS Yfirlit yfir framleiðslugetu PCB PCB
Lögun	getu
Fjöldi laga	4-60L
Í boði HDI PCB tækni	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Hvaða lag sem er
Þykkt	0,3mm-6mm
Lágmarks línubreidd og bil	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35mm
Lágmarks leysirboraður stærð	0,075 mm (3 núll)
Lítil vélræn boruð stærð	0,15 mm (6míl)
Hlutfall fyrir leysigat	0,9: 1
Hlutfall hlutfalls fyrir holu	16: 1
Yfirborðsfrágangur	HASL, blýlaust HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating hard Gold, Selective OSP ， ENEPIG.etc.
Með fyllingarvalkosti	The via er húðaður og fylltur með annaðhvort leiðandi eða óleiðandi epoxý, síðan lokað og húðað yfir
	Kopar fyllt, silfur fyllt
	Leysir með koparhúðuðu lokun
Skráning	± 4míl
Lóðmálmur	Grænn, Rauður, Gulur, Blár, Hvítur, Svartur, Fjólublár, Matte Svartur, Matur grænn osfrv.