Flex Circuit,1Layer Mgbanwe Ebipụtara Board | YMSPCB

Kedu ihe bụ FPC?

Sekit Ebipụtara Mgbanwe (FPC), nke a na-akpọkwa sekit na-agbanwe agbanwe, ma ọ bụ Flex Circuits, site na nkọwa IPC, sekit a na-ebipụta na-agbanwe agbanwe bụ nhazi usoro nke sekit na-ebipụta na ihe ndị na-eji ihe na-agbanwe agbanwe ma ọ bụ na-enweghị mkpuchi mkpuchi na-agbanwe agbanwe. Nkọwa a ziri ezi, ma na-enyefe ụfọdụ ikike enyere ndịiche dị na ihe ndị dị na ala, ihe nduzi, na ihe mkpuchi mkpuchi. Ma mgbe ụfọdụ, a na-akpọ sekit ndị na-agbanwe agbanwe dị ka PCB Flexible ma ọ bụ Flex PCB, nke ahụ bụ n'ihi na echiche dị n'ime ọtụtụ mmadụ bụ na sekit na-agbanwe agbanwe bụ bọọdụ sekit nke a na-ebi ebi (PCB) nke nwere ihe nkiri na-agbanwe agbanwe nke nwere ụkpụrụ nke ndị nduzi ọla kọpa na ya. N'ezie, sekit a na-ebipụta na-agbanwe agbanwe na-enwe akwa oyi akwa nke akara, na-abụkarị ọla kọpa (adịkarịghị agbanwe agbanwe), jikọtara ya na oyi akwa dielectric, na-abụkarị polyimide (adịkarịghị polyester). N'ezie, sekit multilayer flex nwere ike ịnwe ọtụtụ ọkwa ọla. Dị ka onye na-emepụta sekit flex, YMSPCB nwere ike ịmepụta PCB flex 8-layer. Ọkpụrụkpụ nke conductive oyi akwa nwere ike ịdị gịrịgịrị (0.47mil, 12μ, 1/3oz) ka oké (2.8mil, 70μ, 2oz) na dielectric ọkpụrụkpụ nwere ike ịdị iche site 0.5mil (13μ) ka 5mil (125μ). Laminates ọla kọpa na-agbanwe agbanwe (FCCL) nwere ike ịbụ otu akụkụ yana akụkụ abụọ yana ma ọ bụ na-enweghị akwa akwa nke nrapado iji jikọta ọla ahụ na mkpụrụ. A na-eji sekit na-agbanwe agbanwe (FPC) n'ọtụtụ ngwa, sitere na ngwaahịa ndị ahịa kacha ala ruo na njedebe kachasị elu agha na usoro azụmahịa. Ọ bụghị ihe ndabara na ọnụọgụ nke ihe eji emepụta sekit ndị a dị iche iche na-arụ ọrụ dị ka ụdị ngwaahịa a na-eji. A na-eji PCB ndị na-agbanwe agbanwe eme ihe n'ọtụtụ ebe na ngwaọrụ eletrọnịkị dị ka ihe dị mkpa na-enye uru dị n'ịkọkọ, dị gịrịgịrị na nke ukwuu. Dị ka onye na-emepụta sekit a pụrụ ịdabere na ya, anyị na-akwado ụdị 1-8 dị iche iche na-emepụta sekit na-agbanwe agbanwe, gụnyere flex sekit nwere njikọ njikọ thru-hole, lie na / ma ọ bụ kpuru site na njikọ njikọ, lie na kpuru microvia interconnection. Ọzọkwa, YMSPCB na-akwado ink carbon, ink ọlaọcha, constantan, na hatch impedance na-achịkwa sekit na-agbanwe agbanwe.

A na-eji ihe mkpuchi ọla kọpa dị iche iche na Flex Circuit

[Nkọwa usoro]

Ihe mkpuchi ọla kọpa ejiri na FPC dabere na ngwa ndị ahụ.

[Usoro izugbe]

Ọla kọpa foil ihe eji na nkịtị PCB nwere abụọ ụdị ， electrodeposited ọla kọpa foil na akpọrepu ọla kọpa foil, na-eji dị iche iche ngwa.Rolled ọla kọpa foil na-eji ike mgbanwe mmepụta maka compactness na flexure eguzogide.

Electrodeposited ọla kọpa foil na-eji na-abụghị ike flexure ngwa Rolled ọla kọpa foil n'ichepụta usoro ga-emepụta ọtụtụ nrụgide na mgbe ahụ mkpa annealing.Mgbe annealing, akpọrepu ọla kọpa foil nwere adabara ọka Ọdịdị iji gbochie mgbape propagation.Nke ahụ bụ ya mere o nwere mgbanwe iguzogide.