Double sided pcb Normal pcb Lead free HASL Counterbore Manufacturer | YMS PCB
HAL(Lead Free), the full name is Hot Air leveling with Lead Free. Compared with HASL, the main difference for HAL(Lead Free) is the element of material which do not contain Lead(Pb), so it’s RoHS Compliant and it’s much more popular and widely used in PCB fabrikasyon .
HAL(Lead Free) requires higher run temperatures for lead free solder and longer contact time, the production cost for HAL(Lead Free) is slightly higher than HASL(Tin/Lead).
The manufacturing process of HAL(Lead Free) is similar to HASL(Tin/Lead), the circuit boards will be submersed in molten solder(Lead Free). This solder will cover all the exposed copper surfaces. Upon retraction from the solder, high pressure hot air is blown over the surface through air knives, this levels the solder deposit and removes the excess solder from the surface of printed circuit boards.
Enprime Entwodiksyon Komisyon Konsèy Awondisman
Nòmal Enprime Awondisman Komisyon Konsèy: Most PCBs for simple electronics are simple and composed of only a single layer. More sophisticated hardware such as computer graphics cards or motherboards can have 2 or multiple layers, sometimes up to twelve.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.
What is the difference between a Countersink and a Counterbore?
YMS Nòmal kapasite fabrikasyon PCB:
| YMS nòmal PCB fabrikasyon kapasite BECA | ||
| Karakteristik | kapasite | |
| Kouch Konte | 1-60L | |
| Disponib Nòmal PCB Teknoloji | Atravè twou ak Pwopòsyon 16: 1 | |
| antere ak avèg via | ||
| Ibrid | Segondè Frekans Materyèl tankou RO4350B ak FR4 Melanje elatriye. | |
| Gwo vitès materyèl tankou M7NE ak FR4 Mix elatriye. | ||
| Materyèl | CEM- | CEM-1; CEM-2, CEM-4, CEM-5.etc |
| FR4 | EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF, NP170G elatriye. | |
| Gwo vitès | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 Seri, MW4000, MW2000, TU933 elatriye. | |
| Segondè Frekans | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 elatriye. | |
| Lòt moun | Polyimid, Tk, LCP, BT, C-pli, Fradflex, Omega, ZBC2000, PEEK, PTFE, seramik ki baze sou elatriye. | |
| Epesè | 0.3mm-8mm | |
| Max.copper epesè | 10OZ | |
| Minimòm liy lajè ak espas | 0.05mm / 0.05mm (2mil / 2mil) | |
| BGA PITCH | 0.35mm | |
| Min mekanik gwosè komanse fouye | 0.15mm (6mil) | |
| Aspè Pwopòsyon pou nan twou | 16 ： 1 | |
| Sifas Fini | HASL, plon gratis HASL, ENIG, eten imèsyon, OSP, ajan imèsyon, dwèt lò, galvanoplastie difisil lò, selektif OSP ， ENEPIG.etc. | |
| Via Ranpli Opsyon | Via a se plake ak plen ak swa konduktif oswa ki pa kondiktif epoksidik Lè sa a, capped ak plake sou (VIPPO) | |
| Kuiv plen, ajan plen | ||
| Enskripsyon | ± 4mil | |
| Mask soude | Vèt, Wouj, Jòn, Blue, Blan, Nwa, Koulè wouj violèt, Matte Nwa, Matte green.etc. | |
Ou ka renmen:
1、Summary of matters needing attention in circuit board welding
5. Ki sa ki se konsepsyon PCB frekans segondè
Aprann plis bagay sou pwodwi YMS
