HDI PCB 12 Layer 2 Step HDI Board | YMS PCB

Kout Deskripsyon:

HDI PCB is the short form of high-density interconnect printed circuit board, a kind of printed circuit board manufacturing technology.

Yon HDI pkb is a circuit board with a relatively high circuit density that uses micro-blind and buried “via”—or the copper-plated holes in PCBs—technology.

HDI PCB are compact products designed for small-capacity users, as they cost much more than standard PCB.

The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers.

For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism.

You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

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pwodwi Detay

FAQ

pwodwi baj

paramèt

Kouch: 12

Base Material:FR4 High Tg EM827

Epesè ： 1.2 ± 0.1mm

Min.Hole Size：0.15mm

Minimum Line Width/Space：0.075mm/0.075mm

Clearance Minimòm ant Inner Kouch PTH ak Liy ： 0.2mm

Size：101mm×55mm

Aspè Pwopòsyon: 8: 1

tretman sifas: Enig

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Aplikasyon: telekominikasyon

What is HDI PCBs?

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI pkb design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

1.Multi-etap HDI pèmèt koneksyon ki genyen ant nenpòt kouch;

2.Cross-kouch pwosesis lazè ka amelyore nivo nan bon jan kalite nan milti-etap HDI;

3.the konbinezon de HDI ak materyèl-wo frekans, LAMINATES metal ki baze sou, fp ak lòt LAMINATES espesyal ak pwosesis pèmèt bezwen yo nan dansite segondè, epi frekans segondè, segondè Òganize chalè, oswa 3D asanble.

YMS HDI PCB fabrikasyon kapasite kapasite:

YMS HDI PCB fabrikasyon kapasite BECA
Karakteristik	kapasite
Kouch Konte	4-60L
Disponib HDI PCB Teknoloji	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Nenpòt kouch
Epesè	0.3mm-6mm
Minimòm liy lajè ak espas	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35mm
Min lazè komanse fouye gwosè	0.075mm (3nil)
Min mekanik gwosè komanse fouye	0.15mm (6mil)
Aspè Pwopòsyon pou twou lazè	0.9: 1
Aspè Pwopòsyon pou nan twou	16: 1
Sifas Fini	HASL, plon gratis HASL, ENIG, eten imèsyon, OSP, ajan imèsyon, dwèt lò, galvanoplastie difisil lò, selektif OSP ， ENEPIG.etc.
Via Ranpli Opsyon	Via a se plake ak plen ak swa konduktif oswa ki pa kondiktif epoksidik Lè sa a, capped ak plake sou
	Kuiv plen, ajan plen
	Lazè atravè kwiv plake fèmen
Enskripsyon	± 4mil
Mask soude	Vèt, Wouj, Jòn, Blue, Blan, Nwa, Koulè wouj violèt, Matte Nwa, Matte green.etc.