HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Kratki opis:

HDI tiskane ploče offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

parametri

Slojevi: 8

Base Material:FR4 High Tg EM827

Debljina: 1,6 ± 0.10mm

Min.Hole Size：0.15mm

Minimalna Line Širina / Prostor: 0.10mm / 0.10mm

Minimalni razmak između unutarnjeg sloja PTH i linije: 0,2 mm

Veličina: 222mm x 120mm

Aspect Ratio：10.6 : 1

površinska obrada: polaze

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Prijave: računala

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Pojedinosti o proizvodu

Pitanja

Oznake proizvoda

HDI PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

Proces proizvodnje HDI odbor:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

U cjelini, proizvodnja proces HDI ploče kompleksu, koji treba biti dovršen nakon mnogo vremena proizvodnje za dugo vremena. To je ne samo visoke zahtjeve za točnost i skupljanja kontrola svakog sloja, ali i visoke standarde u pogledu materijala, opreme, okoliša i tehničko osoblje.

YMS HDI PCB manufacturing capabilities:

Pregled proizvodnih mogućnosti YMS HDI PCB-a
Značajka	mogućnosti
Broj slojeva	4-60L
Dostupna HDI PCB tehnologija	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Bilo koji sloj
Debljina	0,3 mm-6 mm
Minimalna širina linije i razmak	0,05 mm / 0,05 mm (2 mil. / 2 mil.)
BGA PITCH	0,35 mm
Minimalna veličina bušenja laserom	0,075 mm (3nil)
Min. Mehanička veličina bušenja	0,15 mm (6 mil.)
Omjer slike za lasersku rupu	0,9: 1
Omjer slike za prolaznu rupu	16: 1
Završna obrada	HASL, bezolovni HASL, ENIG, potopni lim, OSP, uronjeno srebro, zlatni prst, galvansko tvrdo zlato, selektivni OSP ， ENEPIG.itd.
Putem opcije popunjavanja	Prolaz je obložen i ispunjen provodljivim ili neprovodljivim epoksidom, a zatim zatvoren i presvučen
	Punjeno bakrom, srebrom
	Laser preko bakreno presvučenog zatvoren
Registracija	± 4mil
Maska za lemljenje	Zelena, crvena, žuta, plava, bijela, crna, ljubičasta, mat crna, mat zelena.itd.