HDI PCB 12 Layer 2 Step HDI Board | YMS PCB

Kratki opis:

HDI PCB is the short form of high-density interconnect printed circuit board, a kind of printed circuit board manufacturing technology.

An HDI PCB is a circuit board with a relatively high circuit density that uses micro-blind and buried “via”—or the copper-plated holes in PCBs—technology.

HDI PCB are compact products designed for small-capacity users, as they cost much more than standard PCB.

The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers.

For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism.

You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

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Pojedinosti o proizvodu

Pitanja

Oznake proizvoda

parametri

Slojevi: 12

Base Material:FR4 High Tg EM827

Debljina: 1,2 ± 0,1 mm

Min.Hole Size：0.15mm

Minimum Line Width/Space：0.075mm/0.075mm

Minimalni razmak između unutarnjeg sloja PTH i linije: 0,2 mm

Size：101mm×55mm

Omjer: 8: 1

površinska obrada: polaze

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Prijave: Telekomunikacije

What is HDI PCBs?

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

1.Multi koraka HDI omogućuje vezu između bilo slojeve;

2.Cross sloj laser obrada može povećati razinu kvalitete više koraka HDI;

3.the kombinacija HDI i visoke frekvencije materijala, metalnih bazi laminata, FPC i druge posebne laminata i procesi omogućuju potrebe visoke gustoće i visoke frekvencije, visoka dovođenja topline, ili 3D montaže.

Sadržaji za proizvodnju YMS HDI PCB-a :

Pregled proizvodnih mogućnosti YMS HDI PCB-a
Značajka	mogućnosti
Broj slojeva	4-60L
Dostupna HDI PCB tehnologija	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Bilo koji sloj
Debljina	0,3 mm-6 mm
Minimalna širina linije i razmak	0,05 mm / 0,05 mm (2 mil. / 2 mil.)
BGA PITCH	0,35 mm
Minimalna veličina bušenja laserom	0,075 mm (3nil)
Min. Mehanička veličina bušenja	0,15 mm (6 mil.)
Omjer slike za lasersku rupu	0,9: 1
Omjer slike za prolaznu rupu	16: 1
Završna obrada	HASL, bezolovni HASL, ENIG, potopni lim, OSP, uronjeno srebro, zlatni prst, galvansko tvrdo zlato, selektivni OSP ， ENEPIG.itd.
Putem opcije popunjavanja	Prolaz je obložen i ispunjen provodljivim ili neprovodljivim epoksidom, a zatim zatvoren i presvučen
	Punjeno bakrom, srebrom
	Laser preko bakreno presvučenog zatvoren
Registracija	± 4mil
Maska za lemljenje	Zelena, crvena, žuta, plava, bijela, crna, ljubičasta, mat crna, mat zelena.itd.