High TG FR4 Material PCB BGA Pitch 0.65mm Wholesale | YMS PCB

Short Description:

When it comes to FR-4 high-TG PCBs wholesale, YMSPCB has the experience and quality products you need for your industry. If you work with PCB that you will be subjecting to high temperatures, you need to be sure those PCBs can take the heat.

At YMSPCB, our high-temperature PCB products can handle extreme PCB glass transition-temperature rates and retain their integrity, so you can use these high-TG FR-4 boards with confidence. We have a 99% plus customer satisfaction rate and are well known for our reliable, fast service as shown by our customer testimonials.

Parameters

Layers: 6L High Tg FR4 Material

Board Thinkness:1.6mm

Base Material:S1000-2 High tg

Min Holes:0.2mm

Minimum Line Width/Clearance：0.075mm/0.075mm

Minimum Clearance between Inner Layer PTH to Line： 0.2mm

Size：194mm×148mm

Aspect Ratio：8 : 1

Surface treatment：ENIG

Single-sided impedance 55Ω±10%, Differential impedance 100+7/-8Ω

Applications: Consumer electronics

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Aluminum PCB is one of the most widely used metal core PCBs, also called as MC PCB, aluminum-clad, or insulated metal substrate, etc.

If working temperature of your product is higher than normal (130-140C), then have to use high Tg material which is > 170C. and popular PCB high value are 170C, 175C, and 180C.

Aluminum PCB is one of the most widely used metal core PCBs, also called as MC PCB, aluminum-clad, or insulated metal substrate, etc. The base structure of the aluminum PCB has no much different from other PCBs. The aluminum base is its notable feature. Usually, aluminum PCB includes four layers: a substrate layer (aluminum layer), a dielectric layer (insulating layer), a circuit layer (copper foil layer), and an aluminum base membrane (protective layer).

As we all know, high-temperature situations will appear when the electronics are operating at high speeds. If the thermal energy cannot be directed away quickly, the components which under high temperature may be softened, deformation, parameters changed, and performance changed, even present safety risks. Aluminum bases can remove the heat from components very soon, which allows high-density and high-power PCB designs to be achieved. The heat dissipation efficiency of aluminum PCB is ten times higher than the fiber-glass base PCBs.

If you have the problem of thermal dissipation in your PCB design, the aluminum board should be your primary consideration. YMS provides all types of aluminum PCBs including single-sided aluminum PCBs, multilayer aluminum PCBs, hybrid aluminum PCBs, flexible aluminum PCBs, through-hole aluminum PCBs, etc. Other categories, such as universal aluminum PCB, high thermal-conductive aluminum PCB, and high-frequency aluminum PCBs are also available. Please do not hesitate to contact us if you need more details about our aluminum PCBs.

High-TG PCB Advanced Circuits Specification

The glass transition temperature of PCB, referred to as “Tg”, indicates the point at which the PCB material will begin to transform. If the operating temperature exceeds the designated Tg value, the board will begin to change from a solid to a liquid state, which is likely to have an adverse effect on its ability to function.

Standard PCBs are manufactured with materials offering a TG value of 140°C, which can withstand an operating temperate of 110°C. While this may not be suitable for extreme-temperature processes that are commonplace in applications such as automotive, industrial or high-temperature electronics. In these situations, a PCB made from FR-4 High TG material can often provide the best solution.

YMS High Tg PCB manufacturing capabilities:

YMS High Tg PCB manufacturing capabilities overview
Feature	capabilities
Layer Count	3-60L
Available Multilayer PCB Technology	Through hole with Aspect Ratio 16:1
	buried and blind via
	Hybrid	High Frequency Material such as RO4350B and FR4 TG 180°Mix etc.
		High Speed Material such as M7NE and FR4 TG 180°Mix etc.
Thickness	0.3mm-8mm
Minimum line Width and Space	0.05mm/0.05mm(2mil/2mil)
BGA PITCH	0.35mm
Min mechanical Drilled Size	0.15mm(6mil)
Aspect Ratio for through hole	16:1
Surface Finish	HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP，ENEPIG.etc.
Via Fill Option	The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over(VIPPO)
	Copper filled, silver filled
Registration	±4mil
Solder Mask	Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc.