kōmike 'inideka | Mass'ōhui | Small'ōhui | la'ana | ||
Nā Pono Hana | FR4 | ʻO Tg maʻamau | Shengyi S1141, KB6160, Huazhen H140 (ʻaʻole e pono no ke alakaʻi i noa kaʻina) | ||
ʻO Middle Tg | No ka HDI, nunui papa: O S1000H, ITEQIT158, HuazhengH150; Li-662; | ||||
Kiʻekiʻena Tg | No ka mānoanoa keleawe, kiʻekiʻe, ahu iho: O S1000-2; ITEQIT180A; HuazhengH170; ISOLA: FR408R; 370HR; Li-752; | ||||
halogen Free | Middle Tg: O S1150G, HuazhengH150HF, H160HF; kiʻekiʻe Tg: O S1165 | ||||
CTI kiʻekiʻe | CTI≥600 O S1600, Huazheng H1600HF, H1600A; | ||||
Frequency kiʻekiʻe | Rogers, Arlon, Taconic, O SCGA-500, S7136; HuazhengH5000 | ||||
Wikiwiki | O S7439; Li-862HF, Li-872SLK; ISOLA: au-Speed, au-Tera @ MT40; Huazheng: H175, H180, H380 | ||||
Mea Pono Flex | Kahua | Glue-noa: Dupont AK XingyangW-type, Panosonic RF-775; | |||
Uhi uhi | O SF305C, Xingyang Q-type | ||||
PP kūikawā | No pele PP: HI-447LF, Taiguang 370BL Arlon 49N | ||||
Pālolo hoopihaia lina kuina: Rogers4450F | |||||
PTFE lina pepa: Arlon6700, Taconic FR-27 / FR-28 | |||||
Menina-kapakahi coatingPI: xingyang N-1010TF-MB | |||||
Kahua Metal | Berguist Al-kumu, Huazheng Al-kumu, chaosun Al-kumu, copperbase | ||||
Kuikawa | High wela ia'ku rigidity Pi: Tenghui HI-901, Arlon 85N, O S260 (Tg250) | ||||
High thermal conductivity mea: 92ML | |||||
Pure pālolo mea: alumina pālolo, Aluminum nitride pālolo | |||||
BT mea: Taiwan Nanya NGP-200WT | |||||
papa | FR4 | 36 | 60 | 140 | |
ʻOʻoleʻa & Flex / (Flex) | 16 (6) | 16 (6) | 24 (6) | ||
High Frequency hui Lamination | 12 | 12 | 20 | ||
100% PTFE | 6 | 6 | 10 | ||
HDI | 2 anuu | 3 anuu | 4 anuu |
kōmike Index | Mass'ōhui | Small'ōhui | la'ana | ||
Ka nui o ka lawe ʻana | Max (mm) | 460 * 560 | 460 * 560 | 550 * 900 | |
(Mm) | Min (mm) | 20 * 20 | 10 * 10 | 5 * 10 | |
Laula, / ka nuku | Lilo o ka (mil) | 0.5OZ kumu keleawe: 3/3 1.0OZ waihona ipu keleawe: 4/4 2.0OZ waihona ipu keleawe: 5/6 | |||
3.0OZ kumu keleawe: 7/9 4.0OZ waihona ipu keleawe: 8/12 5.0OZ waihona ipu keleawe: 10/15 | |||||
6.0OZ kumu keleawe: 12/18 10 oz kumu keleawe: 18/24 12 oz kumu keleawe: 20/28 | |||||
Waho (mil) | 1 / 3OZ kumu keleawe: 3/3 0.5OZ waihona ipu keleawe: 4/4 1.0OZ waihona ipu keleawe: 5/5 | ||||
2.0OZ kumu keleawe: 6/8 3.0OZ waihona ipu keleawe: 7/10 4.0OZ waihona ipu keleawe: 8/13 | |||||
5.0OZ kumu keleawe: 10/16 6.0OZ waihona ipu keleawe: 12/18 10 oz kumu keleawe: 18/24 | |||||
12 oz kumu keleawe: 20/28 15 oz kumu keleawe: 24/32 | |||||
Line laula, ke ahonui, | > 5.0 mil | ± 20% | ± 20% | ± 1.0mil | |
≤5.0 mil | ± 1.0mil | ± 1.0mil | ± 1.0mil | ||
ʻeli | Min kukuna (mm) | 0,1 | 0,1 | 0,1 | |
Min CNC (mm) | 0.2 | 0,15 | 0,15 | ||
Max CNCʻepekema iki (mm) | 6.5 | 6.5 | 6.5 | ||
Min Kino Hole (mm) | 0.5 | 0,4 | 0,4 | ||
PTH Hole (mm) | Maʻamau | ± 0,1 | ± 0,075 | ± 0,075 | |
koiʻana iā Hole | ± 0,05 | ± 0,05 | ± 0,05 | ||
Hole huina (conical) | Laula o ke keena diameter≤6.5mm: 800,900,1000,1100; akea o ka keena diameter≥6.5mm: 900; | ||||
Miomio o ka Hohonu-ke kāohiʻeli (mm) | ± 0,10 | ± 0,075 | ± 0,05 | ||
Helu o ka makapo CNC nā lua o kekahiʻaoʻao | 2 | 3 | ≤4 | ||
Ka palena iki Via puka spacing (kekahi mea ulana pukapuka, koa, 'inikua, ulia kaʻa) mm o | 0.5 | helu 0.45 | 0,4 | ||
Ka palena iki Via puka spacing (kekahi mea ulana pukapuka, mau hanalima hooponopono a me ka consumer uila) mm o | 0,4 | 0,35 | 0,3 |
kōmike 'inideka | Mass'ōhui | Small'ōhui | hāpana | ||
ʻeli | Ka palena iki puka pa spacing o ka ma lua (ka mea ia latike mm) | 0.2 | 0.2 | 0,15 | |
Palena iki puka pā spacing (mm) no ka lima kūlana kiʻekiʻe puka | 0,8 | 0,7 | 0,7 | ||
Ka palena iki mamao mai Via puka a hiki i ka pā keleawe a me ka laina | 0.2 | 0,18 | ≤10L: 0,15 | ||
> 10L: 0,18 | |||||
Ke min mamao mai ka mea i puka i ka pā keleawe a me ka laina | 0,3 | 0,27 | 0,25 | ||
kuʻihao alii | Via puka | 4 (HDI 3mil) | 3.5 (HDI 3mil) | 3 | |
(Mil) | ke keʻena puka | 8 | 6 | 6 | |
Solder makua, (mil) | (Solder ea paha) | 5 | 4 | 4 | |
(Hapalua) | 6 | 5 | 5 | ||
Hope Board mānoanoa | > 1.0 mm o | ± 10% | ± 8% | ± 8% | |
≤1.0 mm o | ± 0.1mm | ± 0.1mm | ± 0.1mm | ||
Papa mānoanoa (mm) | 0.5-5.0 | 0.4-6.5 | 0.3-11.5 | ||
Papa mānoanoa /ʻepekema iki | 10:01:00 | 12:01:00 | 13:01:00 | ||
Via puka (ʻepekema iki) kuʻina puka (polokalamu solder) | 0.25-0.5mm | 0.20-0.5mm | 0.15-0.6mm | ||
Makapo kanu puka, puka i loko o pale | 0.25-0.5mm | 0.20-0.5mm | 0.10-0.6mm | ||
Kakaka a me Ke Kai | ≤0.75% | ≤0.75% | ≤0.5% | ||
Impedance Na Makuahine | ≥5.0mil | ± 10% | ± 10% | ± 8% | |
<5.0mil | ± 10% | ± 10% | ± 10% | ||
ʻO CNC | contour ke ahonui, (mm) | ± 0,15 | ± 0,10 | ± 0,10 | |
V-kua ioeeiiaiey o koena mānoanoa (mm) | ± 0,15 | ± 0,10 | ± 0,10 | ||
Hoʻolele leo kau (mm) | ± 0,15 | ± 0,10 | ± 0,10 | ||
Miomio o ka lāʻau hohonu mīkini wili pōhaku (mm) | ± 0,15 | ± 0,10 | ± 0,10 |
kōmike 'inideka | Mass'ōhui | Small'ōhui | hāpana | ||
Contour | Bevel lihi | 20 ~ 60 degere; ± 5degree | |||
'ilikai ohe. | kaiapuni gula | Ni mānoanoa (anakahi iki'īniha) | 118-236 | 118-236 | 118-236 |
Max gula (uinch) | 3 | 3 | 6 | ||
Hard gula (Au manoanoa) | Gold manamana lima (uinch) | 15 | 30 | 60 | |
NiPdAu | NI (uinch) | 118-236 | |||
PA (uinch) | 2-5 | ||||
Au (uinch) | 1-5 | ||||
Kaiapili uila gula | NI (uinch) | 120-400 | |||
AU (uinch) | 1-3 | ||||
kaiapuni piuta | Piuta (aku) | 0.8-1.2 | |||
kaiapuni AG | AG (uinch) | 6-10 | |||
OSP | manoanoa (aku) | 0.2-0.5 | |||
HAL / HAL LF | BGApad (mm) | ≥0.3 × 0,3 | |||
mānoanoa (mm) | 0.6≤H≤3.0 | ||||
Papa mānoanoa makou puka anawaena | Press hole≤3: 1 | ||||
Piuta (aku) | 2.0-40.0 | ||||
ʻOʻoleʻa & Flex | I kā mākou dielectric mānoanoa o ka flex | Glue -free 25um | Glue-noa 75um | Glue-free75um | |
Flex hapa laula (mm) | ≥10 | 5 | 5 | ||
Max haawi nui (mm) | 200 × 400 | 200 × 500 | 400 × 550 | ||
loihi o Via lua e kae o kaʻoʻoleʻa & flex (mm) | ≥1.2 | ≥1.0 | ≥0.8 | ||
(Mm) mamao o eiiiiiaiou lua a hiki i ke kihi o R & F | ≥1.5 | ≥1.2 | ≥1.0 | ||
kōmike 'inideka | Mass'ōhui | Small'ōhui | hāpana | ||
ʻOʻoleʻa & Flex | 'ole | Ka mea mawaho, ahu iho 'ole o ka flex hapa, ka Pi kilo' ole, a me ka hookaawale ana 'ole | Aluminum me ka nānā 'ʻoʻoleʻa flex,ʻoʻoleʻa flex HDI, me ka hui pu, electromagnetic a paleia lakou ho film | ||
Specialʻenehana | Backʻeli PCB, metala Hawaii, ao ke keleawe kanu makapo puka, ka anu u kau, iwi kuamoʻo puka, hapalua puka, hui lamination | Kanuʻume mākenēki kāna mau 'ōlelo PCB | Kanu mea pihana / mea pale mū holapū, i loko iho keleawe ma ka hapa wahi, 100% pālolo PCB, kanu riveting Nut PCB, i loko iho eiiiiiaiou PCB |
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