ʻO ka nānā ʻana o nā huahana FPC flex board

ʻO ka FPC flex board kahi huahana maʻamau i ka ʻoihana uila, hoʻohana nui ʻia i nā huahana uila e like me nā lako kamaʻilio, nā kamepiula, nā uila uila a me nā mea ʻenehana a me nā mea pono hale like ʻole. ʻO kāna hana nui ke kākoʻo i nā ʻāpana kaapuni a me nā ʻāpana kaapuni pili. ʻO ka papa palupalu FPC kahi ʻano nui o nā papa kaapuni paʻi. Wahi a ke ʻano o nā papa kaapuni paʻi paʻi FPC, hiki ke hoʻokaʻawale ʻia nā mea hana FPC i hoʻokahi ʻaoʻao, ʻaoʻao ʻelua a me nā papa he nui e like me ka helu o nā papa conductor.

Kaʻina hana FPC

FPC ʻaoʻao hoʻokahi:

ʻO ka laminate keleawe ʻaoʻao hoʻokahi ʻaoʻao → ʻoki Lamination → holoi, hoʻomaloʻo → wili a kuʻi paha → laina paʻi pale anti-etching pattern a i ʻole ka hoʻohana ʻana i kahi kiʻiʻoniʻoni maloʻo → hoʻopaʻa i ka nānā ʻana a me ka hoʻoponopono ʻana → etching copper → etching resistance ink, maloʻo → holoi, maloʻo → solder mask , UV hoola → pale pale, UV hoola → preheating, punching a me ka Form → wehe  pōkole kaapuni  ho'āʻo → holoi, maloʻo → pre-coated soldering anti-oxidant (maloʻo) aiʻole ka ea wela flattening → inspection packaging → hoʻopau huahana.

FPC ʻaoʻao ʻelua:

ʻO ka laminate keleawe ʻelua ʻaoʻao → ʻoki Lamination → lamination → CNC drilling → nānā, hoʻomaʻemaʻe burr → PTH → piha piha electroplated keleawe lahilahi → nānā, holoi → pale ʻino ʻole Circuit pattern, curing (kiʻi ʻoniʻoni maloʻo a i ʻole kiʻi ʻoniʻoni, hoʻomohala) → ka nānā ʻana, hoʻoponopono hou ʻana → ka hoʻopili ʻana i ke ʻano laina → electroplating tin (resistance nickel/gold) → kūʻē i ka inika (photosensitive film) → → etching copper → (DE-WETTING) → Clean → solder mask (kiʻi ʻoniʻoni maloʻo a i ʻole kiʻi ʻoniʻoni pulu, ʻike, hoʻomohala, hoʻomaʻemaʻe wela) → hoʻomaʻemaʻe, hoʻomaloʻo → paʻi pale, hoʻōla → ( HASL ) → Profile → hoʻomaʻemaʻe, hoʻomaloʻo →  hoʻāʻo kaapuni pōkole wehe → hōʻike hōʻike → hoʻopau huahana.