High māmā PCB POFV hoʻokomo poho ho'āʻo enepig| YMSPCB
He aha ka High Speed PCB?
ʻO ka "High Speed" ka mea maʻamau i ke ʻano o nā kaapuni kahi i ʻoi aku ai ka lōʻihi o ka piʻi ʻana a i ʻole ka hāʻule ʻana o ka hōʻailona ma mua o hoʻokahi hapaono o ka lōʻihi o ka laina hoʻouna ʻoi aku ka lōʻihi ma mua o ka lōʻihi o ka laina hoʻouna, a laila hōʻike ka lōʻihi o ka laina hoʻouna i ke ʻano o ka laina lumped.
Ma kahi PCB wikiwiki loa ka manawa ala e hiki ai i ka bandwidth no ka hōʻailona kikohoʻe ke hoʻonui i nā alapine kiʻekiʻe MHz a i ʻole GHz. Ke hana ʻia kēia, aia kekahi mau pilikia hōʻailona e ʻike ʻia inā ʻaʻole i hoʻolālā ʻia kahi papa me ka hoʻohana ʻana i nā lula hoʻolālā PCB kiʻekiʻe. ʻO ka mea nui, ʻike paha kekahi:
1. Uncceptably nui transient kani. Hana ʻia kēia i ka wā ʻaʻole ākea nā traces, ʻoiai pono ʻoe e makaʻala i ka hoʻonui ʻana i kāu mau traces (e ʻike i ka ʻāpana o Impedance Contorl i ka PCB Design ma lalo). Inā ʻoi aku ka nui o ke kani transient, loaʻa iā ʻoe ka overshoot nui a i ʻole undershoot i kāu hoʻololi hōʻailona.
2.Strong crosstalk. Ke piʻi aʻe ka wikiwiki o ka hōʻailona (ʻo ia hoʻi, i ka emi ʻana o ka manawa piʻi), hiki i ka capacitive crosstalk ke lilo i mea nui e like me ka ʻike ʻana i kēia manawa i ka capacitive impedance.
3. Hoʻopau nā mea hoʻokele a me nā mea hoʻokipa. Hiki i kāu mau hōʻailona ke noʻonoʻo i nā mea ʻē aʻe ke loaʻa kahi impedance mismatch. Inā lilo ka impedance mismatch i mea koʻikoʻi e pono e nānā i ka impedance hoʻokomo, hoʻouka impedance, a me ka laina hoʻoili impedance hiʻona no kahi pilina. Hiki iā ʻoe ke heluhelu hou aku e pili ana i kēia ma ka ʻāpana aʻe.
4. Power integrity pilikia (transient PDN ripple, ground bounce, etc.). ʻO kēia kekahi pūʻulu o nā pilikia hiki ʻole ke pale ʻia i kekahi hoʻolālā. Eia nō naʻe, hiki ke hoʻemi nui ʻia ka ripple PDN transient a me nā EMI e hiki mai ana ma o ka hoʻolālā stackup kūpono a me nā ana decoupling. Hiki iā ʻoe ke heluhelu hou aʻe e pili ana i ka hoʻolālā stackup PCB kiʻekiʻe ma hope o kēia alakaʻi.
5. EMI ikaika i alakaʻi ʻia a hoʻomālamalama ʻia. ʻO ke aʻo ʻana o ka hoʻoponopono ʻana i nā pilikia EMI he nui, ma ka pae IC a me ka pae hoʻolālā PCB kiʻekiʻe. ʻO ka EMI he kaʻina hana pānaʻi; inā ʻoe e hoʻolālā i kāu papa e loaʻa i ka palekana EMI ikaika, a laila e hoʻemi ʻia ka EMI. Eia hou, ʻo ka hapa nui o kēia i ka hoʻolālā ʻana i ka stackup PCB kūpono.
Hāʻawi pinepine nā PCB kiʻekiʻe i kahi alapine mai 500MHz a 2 GHz, hiki ke hoʻokō i nā pono o nā hoʻolālā PCB kiʻekiʻe, microwave, radiofrequency, a me nā noi kelepona. Ke piʻi ka alapine ma luna o 1 GHz, hiki iā mākou ke wehewehe i ke alapine kiʻekiʻe.
Ke piʻi mau nei ka paʻakikī o nā ʻāpana uila a me nā hoʻololi i kēia mau lā a pono ka wikiwiki o ka kahe o ka hōʻailona. No laila, koi ʻia nā alapine hoʻoili kiʻekiʻe. Kōkua nui nā PCB kiʻekiʻe i ka hoʻohui ʻana i nā koi hōʻailona kūikawā i nā ʻāpana uila a me nā huahana me nā pono e like me ke kiʻekiʻe o ka pono, a me ka wikiwiki wikiwiki, haʻahaʻa attenuation, a me nā waiwai dielectric mau.
Hoʻohana nui ʻia nā PCB kiʻekiʻe i ka lekiō a me ka wikiwiki kiʻekiʻe, e like me 5G kelepona ʻole, nā mea ʻike radar automotive, aerospace, satellite, a me nā mea ʻē aʻe.
· Hoʻolālā ʻāpana-nui
Hoʻohana maʻamau mākou i nā PCB multi-layered i nā hoʻolālā PCB kiʻekiʻe. ʻO nā PCB i hoʻohui ʻia he hui nui a me ka liʻiliʻi liʻiliʻi, e kūpono loa iā lākou no nā pūʻolo hopena. A ua maʻalahi nā papa multi-layer e hoʻopōkole i nā pilina ma waena o nā mea uila a hoʻomaikaʻi i ka wikiwiki o ka hoʻouna ʻana i nā hōʻailona.
ʻO ka hoʻolālā mokulele honua kahi mea nui o nā noi kiʻekiʻe no ka mea ʻaʻole ia e mālama i ka maikaʻi o ka hōʻailona akā kōkua pū kekahi i ka hōʻemi ʻana i nā radiations EMI.
1. Hoʻololi ʻia ka permittivity.
2.Low attenuation no ka hoʻouna hōʻailona kūpono.
3.Homogeneous hana me ka haʻahaʻa tolerances i insulation mānoanoa a me ka dielectric mau. Ke piʻi wikiwiki nei ka noi no nā huahana PCB kiʻekiʻe a me ka wikiwiki i kēia mau lā. Ma ke ʻano he mea hana PCB Hookah , ke kālele nei ʻo YMS i ka hāʻawi ʻana i nā mea kūʻai aku me ka hilinaʻi kiʻekiʻe-frequency PCB prototyping me ke ʻano kiʻekiʻe. Inā loaʻa iā ʻoe kekahi pilikia me ka hoʻolālā PCB a i ʻole ka hana PCB, e ʻoluʻolu e kelepona mai iā mākou.
ʻO YMS High Speed PCB manaʻo hiki ke hana | ||
Hiʻona | nā hiki | |
Helu Layer | 2-30L | |
Loaʻa WikiwikiPCB Technology | Ma o ka lua me Aspect Ratio 16: 1 | |
kanu ʻia a makapō ma | ||
Hui dielectric Boards ( High Speed Mea Pono + FR-4 pu ana) | ||
Kupono WikiwikiPono Ha awina i loaʻa: M4, M6 puke, N4000-13 puke, FR408HR, TU862HF TU872SLKSP, EM828, etc. | ||
ʻO ka hoʻomanawanui ʻana o ka Etch ma nā hiʻohiʻona RF koʻikoʻi: +/- .0005″ ka hoʻomanawanui maʻamau no ke keleawe 0.5oz i hoʻopaʻa ʻole ʻia. | ||
ʻO ka hana ʻana o nā lua nui, nā ʻāpana keleawe a me nā slugs, Metal Core & Metal Back, Thermally conductive laminates, Edge Plating, etc. | ||
Mānoanoa | 0.3mm-8mm | |
Ka laina liʻiliʻi loa a me ka lewa | 0.075mm/0.075mm(3mil/3mil) | |
BGA PITCH | 0.35mm | |
Min kukuna ʻeli ʻia ka nui | 0.075mm (3nil) | |
Min mīkini ʻeli ka nui | 0.15mm (6mil) | |
Lākiō hiʻohiʻona no ka puka kukuna | 0.9: 1 | |
Lākiō hiʻohiʻona no ma o ka puka | 16: 1 | |
ʻIli Pau | Kupono WikiwikiPCB urface nā kūlanaʻelua: Electroless nikala, kaiapuni Gold, ENEPIG, e alakai noa HASL, kaiapuni kala | |
Via Hoʻopiha Hoʻopiha | Hoʻopili ʻia ka via a hoʻopihapiha ʻia me kekahi epoxy conductive a i ʻole non-conductive a laila kāpili ʻia a plated ma luna (VIPPO) | |
Piha keleawe, hoʻopiha kālā | ||
Paʻa ʻia ka laser ma o ke keleawe | ||
Kakau inoa | ± 4milā | |
Makakiʻi paukū | ʻŌmaʻomaʻo, ʻulaʻula, melemele, polū, keʻokeʻo, ʻeleʻele, poni, Matte ʻeleʻele, Matte ʻōmaʻomaʻo. |