HDI pcb i kēlā me kēia papa hdi pcb wikiwiki wikiwiki hoʻokomo hoʻoweliweli hōʻike enepig | YMSPCB

HDI pcb i kēlā me kēia papa hdi pcb wikiwiki wikiwiki hoʻokomo hoʻoweliweli hōʻike enepig | Kiʻi YMSPCB kiʻi ʻia

Pōkole Description:

HDI any-layer printed circuit boards,sometimes also called an ELIC – Every Layer Interconnect HDI, is a PCB where each layer is a microvia-based HDI layer, and all the connections between the layers are made using copper filled microvias.

kiko'î

Nā Pākuʻi: 12L HDI kekahi-papa pcb

Manaʻo Papa: 1.6mm

Nā Pono Hana: M7NE

Nā Lā Min: 0.2mm

Ka Laina Laina / ʻĀina: 0.075mm / 0.075mm

Ka ʻoluʻolu liʻiliʻi ma waena o ka papa o ka hohonu PTH a me ka laina: 0.2mm

Ka nui ： 107.61mm × 123.45mm

Lākiō hiʻohiʻona: 10: 1

ʻIlikai ʻili: ENEPIG + Manamana gula

Hana kūikawā: ʻO kēlā me kēia papa hdi pcb, mea wikiwiki kiʻekiʻe, plating gula paʻakikī no nā mea hoʻopili lihi, hōʻoia hoʻoweliweli hoʻokomo, Z-axis milling, Laser ma o ke keleawe pani ʻia pani

Special Hoʻokō ': mānoanoa o Gold manamana lima: 12 "

ʻO ka impedance ʻokoʻa 100 + 7 / -8Ω

Nā noi: Optical module

E hoʻouna leka uila iā mākou Download like PDF

ʻIke kikoʻī

NPP

Nā huahana huahana

He aha ka HDI PCB

ʻO HDI PCB ka PCB: High density interconnect PCB, are a way of making more room on your printed circuit board to make them more efficient and allow for faster transmission. It's relatively easy for most enterprising companies that are using printed circuit boards to see how this can benefit them.

Nā pōmaikaʻi o HDI PCB

ʻO ke kumu maʻamau no ka hoʻohana ʻana i ka ʻenehana HDI kahi hoʻonui nui i ka nui o ka hoʻopili ʻana. Loaʻa ka hakahaka i loaʻa ʻia e nā kūkulu ʻoi loa no nā ʻāpana. Ma waho aʻe, e hoʻemi ʻia nā koi ākea ma nā papa liʻiliʻi a me nā papa liʻiliʻi.

Loaʻa FPGA a BGA paha me ka 1mm a ʻoi iki ke kau ʻana. Hana maʻalahi ʻenehana HDI i ka hoʻokele a me ka pilina maʻalahi, keu hoʻi i ka hoʻokele ma waena o nā pin.

Hana ʻo YMS HDI PCB hana capa :

ʻO YMS HDI PCB hana hana nānā ākea
Hiʻona	nā hiki
Helu Layer	4-60L
Loaʻa HDI ʻenehana HDB	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Kekahi papa
Mānoanoa	0.3mm-6mm
Ka laina liʻiliʻi loa a me ka lewa	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35mm
Min kukuna ʻeli ʻia ka nui	0.075mm (3nil)
Min mīkini ʻeli ka nui	0.15mm (6mil)
Lākiō hiʻohiʻona no ka puka kukuna	0.9: 1
Lākiō hiʻohiʻona no ma o ka puka	16: 1
ʻIli Pau	HASL, Alakai manuahi HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP, ENEPIG.etc.
Via Hoʻopiha Hoʻopiha	Hoʻopili ʻia ka via a hoʻopiha ʻia me kekahi epoxy conductive a i ʻole non-conductive a laila kāpili ʻia a uhi ʻia i luna
	Piha keleawe, hoʻopiha kālā
	Paʻa ʻia ka laser ma o ke keleawe
Kakau inoa	± 4milā
Makakiʻi paukū	ʻŌmaʻomaʻo, ʻulaʻula, melemele, polū, keʻokeʻo, ʻeleʻele, poni, Matte ʻeleʻele, Matte ʻōmaʻomaʻo.