Hana ʻia ʻo Ceramic PCB hoʻokahi a ʻelua ʻaoʻao ʻaoʻao ʻelua PCB i nā ʻāpana Ceramic | YMS PCB

ʻO ka PCB seramika: papa kaapuni pāpaʻa seramika

Hōʻike ka Ceramic Substrate i kahi papa hana kū hoʻokahi kahi i hoʻopili pololei ʻia ai ka pahu alumini keleawe i ka ʻili (ʻaoʻao hoʻokahi a i ʻole ʻaoʻao ʻelua) o ka alumina (Al2O3) a i ʻole ka alumini alumini nitride (AlN) paʻa seramika māmā i ka wela. Ke hoʻohālikelike ʻia me ka FR-4 maʻamau a i ʻole ka substrate alumini māmā, ʻo ka ultra-thin composite substrate i hana ʻia he ʻokoʻa ka maikaʻi o ka insulation uila, kiʻekiʻe thermal conductivity, ʻokoʻa palupalu palupalu a me ke kūpaʻa paʻa kiʻekiʻe, a hiki ke kahakaha ʻia i nā kiʻi he nui e like me ka PCB, me maikaʻi loa i kēia manawa lugging hiki. He mea kūpono ia no nā mea me nā hanauna mehana kiʻekiʻe (ke kukui kukui kiʻekiʻe, ka mana o ka lā), a ʻoi aku ka maikaʻi o kona kūpaʻa ʻana i ke ʻano o ka wā ma waho. Hoʻolauna ʻenehana Papa Kaapuni Ceramic
No ke aha e hoʻohana ai i nā mea seramika e hana i nā papa kaapuni? Hana ʻia nā papa kaapuni seramika me nā seramika uila a hiki ke hana ʻia i nā ʻano like ʻole. ʻO nā hiʻohiʻona o ka pale wela kiʻekiʻe a me ka insulation uila kiʻekiʻe o nā papa kaapuni seramika ka mea kaulana loa. ʻO nā mea maikaʻi o ka haʻahaʻa dielectric mau a me ka dielectric nalowale, kiʻekiʻe thermal conductivity, maikaʻi kemika kūpaʻa, a me ka thermal hoʻonui coefficient i nā mea nui pū kekahi. ʻO ka hana ʻana o nā papa kaapuni seramika e hoʻohana i ka ʻenehana LAM, ʻo ia ka laser rapid activation metallization technology. Hoʻohana ʻia lākou ma ke kahua LED, nā modula semiconductor mana kiʻekiʻe, nā pahu hau semiconductor, nā mea hoʻomehana uila, nā mana mana mana, nā mana hybrid circuits, nā ʻāpana mana akamai, kiʻekiʻe-frequency hoʻololi mana lako, solid-state relays, automotive electronics, communications, aerospace, a me nā mea uila uila.
ʻO nā pono o ka PCB Ceramic ʻAʻole
like me ka FR-4 kuʻuna, ʻoi aku ka maikaʻi o nā mea seramika i ka hana kiʻekiʻe a me ka hana uila, he kiʻekiʻe thermal conductivity, paʻa kemika, kūpaʻa wela maikaʻi, a me nā waiwai ʻē aʻe i loaʻa ʻole i nā substrates organik. He mea hou ia no ka hoʻokumu ʻana i nā kaʻapuni hoʻohui nui a me nā modula uila mana.
ʻO nā pono nui: ʻoi aku
ka kiʻekiʻe o ka thermal conductivity.
ʻOi aku ka nui o ka hoʻonui ʻana wela.
ʻOi aku ka ikaika a me ka haʻahaʻa haʻahaʻa o ka metala kiʻiʻoniʻoni alumina ceramic circuit board.
He maikaʻi ka solderability o ka substrate, a he kiʻekiʻe ka mahana hoʻohana.
ʻO ka hoʻokaʻawale maikaʻi.
Haʻahaʻa kiʻekiʻe-frequency poho.
Hiki i ka hui kiʻekiʻe.
ʻAʻole i loko o nā mea kūlohelohe, kūpaʻa i nā kukui cosmic, he hilinaʻi kiʻekiʻe i ka aerospace, a he lōʻihi ke ola lawelawe.
ʻAʻole i loaʻa i ka papa keleawe kahi papa oxide a hiki ke hoʻohana ʻia no ka manawa lōʻihi i kahi ea hoʻemi. Hiki ke hoʻohana maikaʻi ʻia nā PCB Ceramic no nā papa kaapuni paʻi i kēia mau ʻoihana a me nā ʻoihana ʻē aʻe, e pili ana i kāu hoʻolālā a me nā pono hana.

ʻO Ceramic PCB kahi ʻano wela e hoʻokele ana i ka pauka ceramic a me ka mea hoʻopili organik, a ua hoʻomākaukau ʻia ka heat conduction organic ceramic PCB ma kahi conductivity thermal o 9-20W/m. I nā huaʻōlelo ʻē aʻe, ʻo ka ceramic PCB kahi papa kaapuni i paʻi ʻia me nā kumu kumu ceramic, ʻo ia nā mea thermally conductive e like me ka alumina, alumini nitride, a me ka beryllium oxide, hiki ke hana i ka hopena wikiwiki i ka hoʻololi ʻana i ka wela mai nā wahi wela a me ka dissipating. ia maluna o ka ili a pau. ʻO ka mea hou aku, ua hana ʻia ka ceramic PCB me ka ʻenehana LAM, ʻo ia ka ʻenehana hoʻōla wikiwiki laser. No laila, ʻoi aku ka maʻalahi o ka PCB ceramic e hiki ke hana i ka papa kaapuni kuʻuna holoʻokoʻa me ka hana ʻoi aku ka paʻakikī me ka hana i hoʻonui ʻia.

Ma waho aʻe o ka  MCPCB , inā makemake ʻoe e hoʻohana i ka PCB i ke kaomi kiʻekiʻe, ka insulation kiʻekiʻe, ke alapine kiʻekiʻe, ka wela kiʻekiʻe, a me nā huahana uila uila hilinaʻi a me nā mea liʻiliʻi, a laila ʻo Ceramic PCB kāu koho maikaʻi loa.

No ke aha he hana maikaʻi loa ka Ceramic PCB? Hiki iā ʻoe ke ʻike pōkole i kona ʻano kumu a laila maopopo ʻoe.

• 96% a i ʻole 98% Alumina (Al2O3), Aluminum Nitride (ALN), a i ʻole Beryllium Oxide (BeO)
• Mea alakaʻi: No ka ʻenehana kiʻiʻoniʻoni lahilahi, ʻo ia ka palladium kālā (AgPd), pllladium gula (AuPd); No DCB (Direct Copper Bonded) he keleawe wale nō
• Manawa noi: -55~850C
• Ka waiwai hoʻoili wela: 24W~28W/mK (Al2O3); 150W~240W/mK no ALN, 220~250W/mK no BeO;
• Ka ikaika hoʻoemi ʻoi loa: >7,000 N/cm2
• Ka Voltage Breakdown (KV/mm): 15/20/28 no 0.25mm/0.63mm/1.0mm kēlā me kēia
• Hoʻonui ʻia ka wela (ppm/K): 7.4 (ma lalo o 50~200C)

Nā ʻano o nā PCB seramika

1. Kiʻekiʻe wela ceramic PCB

2. Haʻahaʻa wela seramika PCB

3.Thick kiʻi ceramic PCB

 Nā mana hana YMS Ceramic PCB: