HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Pōkole Description:

Nā papa kaapuni paʻi HDI offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

kiko'î

Papa: 8

Base Material:FR4 High Tg EM827

Mānoanoa: 1,6 ± 0.10mm

Min.Hole Size：0.15mm

Ka palena iki Line laula / Space: 0.10mm / 0.10mm

Ka ʻoluʻolu liʻiliʻi ma waena o ka papa o ka hohonu PTH a me ka laina: 0.2mm

Size: 222mm × 120mm

Aspect Ratio：10.6 : 1

ʻIlikai lapaʻau: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

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Nā huahana huahana

ʻO HDI PCB ka PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI Board? Iecaianoaaiiuo kaʻina:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Ma ka a pau, ke? Iecaianoaaiiie kaʻina hana o HDI papa ka luna ', i pono ia e pau ma hope o na manawa he nui o ka? Iecaianoaaiiuo no ka lōʻihi manawa. OʻAʻole wale kiʻekiʻe e pono ai no ka pololei a me ka shrinkage mana o kēlā me kēia ahu iho, akā, i nā ana kiʻekiʻe ma ka pono, pono, i hoʻolilo 'ia a me ka oaoieei nā limahana.

YMS HDI PCB manufacturing capabilities:

ʻO YMS HDI PCB hana hana nānā ākea
Hiʻona	nā hiki
Helu Layer	4-60L
Loaʻa HDI ʻenehana HDB	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Kekahi papa
Mānoanoa	0.3mm-6mm
Ka laina liʻiliʻi loa a me ka lewa	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35mm
Min kukuna ʻeli ʻia ka nui	0.075mm (3nil)
Min mīkini ʻeli ka nui	0.15mm (6mil)
Lākiō hiʻohiʻona no ka puka kukuna	0.9: 1
Lākiō hiʻohiʻona no ma o ka puka	16: 1
ʻIli Pau	HASL, Alakai manuahi HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP, ENEPIG.etc.
Via Hoʻopiha Hoʻopiha	Hoʻopili ʻia ka via a hoʻopiha ʻia me kekahi epoxy conductive a i ʻole non-conductive a laila kāpili ʻia a uhi ʻia i luna
	Piha keleawe, hoʻopiha kālā
	Paʻa ʻia ka laser ma o ke keleawe
Kakau inoa	± 4milā
Makakiʻi paukū	ʻŌmaʻomaʻo, ʻulaʻula, melemele, polū, keʻokeʻo, ʻeleʻele, poni, Matte ʻeleʻele, Matte ʻōmaʻomaʻo.