High Tg material PCB 6 Layer High Tg Board| YMS PCB

Pōkole Description:

High TG PCBs have an array of applications, from engines to industrial processes, WiFi boosters, and computer systems. They mitigate the internal damage a machine does to itself when it functions by raising the tolerance of a device to heat, moisture, and chemical corrosion. Not only do they improve functionality, but they also enhance the lifespan of PCBs in general by reducing common issues like short-circuiting. If you are looking to get the best-embedded systems or a high TG PCB Hookah , look no further. You can use YMS technology to design your high TG PCB boards.

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Layers: 6L High Tg FR4 Material Manaʻo Papa: 1.6mm Base Material:EM827 High tg Nā Lā Min: 0.2mm Ka Laina Laina / ʻĀina: 0.075mm / 0.075mm Ka ʻoluʻolu liʻiliʻi ma waena o ka papa o ka hohonu PTH i ka laina: 0.2mm Size：214mm×148mm Lākiō hiʻohiʻona: 8: 1 ʻIlikai lapaʻau: ENIG Single-sided impedance 55Ω±10%, Differential impedance 100+7/-8Ω Applications: Consumer electronics

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High-TG PCB Advanced Circuits Specification

The glass transition temperature of PCB, referred to as "Tg", indicates the point at which the PCB material will begin to transform. If the operating temperature exceeds the designated Tg value, the board will begin to change from a solid to a liquid state, which is likely to have an adverse effect on its ability to function.

Standard PCBs are manufactured with materials offering a TG value of 140°C, which can withstand an operating temperate of 110°C. While this may not be suitable for extreme-temperature processes that are commonplace in applications such as automotive, industrial or high-temperature electronics. In these situations, a PCB made from FR-4 High TG material can often provide the best solution.

YMS High Tg PCB manufacturing capabilities:

YMS High Tg PCB manufacturing capabilities overview
Hiʻona	nā hiki
Helu Layer	3-60L
Loaʻa ka ʻenehana PCB Multilayer	Ma o ka lua me Aspect Ratio 16: 1
	kanu ʻia a makapō ma
	ʻano huila	High Frequency Material such as RO4350B and FR4 TG 180°Mix etc.
		High Speed Material such as M7NE and FR4 TG 180°Mix etc.
Mānoanoa	0.3mm-8mm
Ka laina liʻiliʻi loa a me ka lewa	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35mm
Min mīkini ʻeli ka nui	0.15mm (6mil)
Lākiō hiʻohiʻona no ma o ka puka	16: 1
ʻIli Pau	HASL, Alakai manuahi HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP, ENEPIG.etc.
Via Hoʻopiha Hoʻopiha	Hoʻopili ʻia ka via a hoʻopihapiha ʻia me kekahi epoxy conductive a i ʻole non-conductive a laila kāpili ʻia a plated ma luna (VIPPO)
	Piha keleawe, hoʻopiha kālā
Kakau inoa	± 4milā
Makakiʻi paukū	ʻŌmaʻomaʻo, ʻulaʻula, melemele, polū, keʻokeʻo, ʻeleʻele, poni, Matte ʻeleʻele, Matte ʻōmaʻomaʻo.