Special Design for China Multilayer Printed Circuit Board PCB Fabrication with UL

Short Description:

Multilayer pcb with sideplating and half-cut castellated holes, the PCB edge is used for technical features of the later assembly.

Parameters

Layers: 10L multilayer pcb

Board Thinkness:2.0mm

Base Material:S1000-2 High tg

Min Holes:0.2mm

Minimum Line Width/Clearance：0.25mm/0.25mm

Minimum Clearance between Inner Layer PTH to Line： 0.2mm

Size：250.6mm×180.5mm

Aspect Ratio：10 : 1

Surface treatment：ENIG+ Selective hard gold

Process characteristics: High tg, Sideplating, Selective hard gold, Half-cut Castellated Holes

Applications: Wi-Fi modules

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What is Multilayer PCBs

Multilayer Printed Circuit Board, It is a type of PCB which comes with a combination of single sided PCB and double sided PCB. It features layers more than double sided PCB.

PCB with special requirements from industries

PCB Sideplating

Sideplating is the metalization of the board edge in the PCB filed. Edge plating, Border plated, plated contour, side metal, these words can also be used to describe the same function.

Half-cut Castellated Holes

Castellations are plated through holes or vias located in the edges of a printed circuit board. are indentations created in the form of semi-plated holes on the edges of the PCB boards.These half holes serve as pads intended to create a link between the module board and the board that it will be soldered onto.

YMS Multilayer PCB manufacturing capabilities:

YMS Multilayer PCB manufacturing capabilities overview
Feature	capabilities
Layer Count	3-60L
Available Multilayer PCB Technology	Through hole with Aspect Ratio 16:1
	buried and blind via
	Hybrid	High Frequency Material such as RO4350B and FR4 Mix etc.
		High Speed Material such as M7NE and FR4 Mix etc.
Thickness	0.3mm-8mm
Minimum line Width and Space	0.05mm/0.05mm(2mil/2mil)
BGA PITCH	0.35mm
Min mechanical Drilled Size	0.15mm(6mil)
Aspect Ratio for through hole	16:1
Surface Finish	HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP，ENEPIG.etc.
Via Fill Option	The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over(VIPPO)
	Copper filled, silver filled
Registration	±4mil
Solder Mask	Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc.