High Tg PCB Advanced PCB Manufacturing| YMS PCB
How do I classify high-TG materials?
de materiais | TG | MOT |
FR4-standard-TG | 130°C | 110°C |
FR4-mittel-TG | 150°C | 130°C |
FR4-hoch-TG | 170°C | 150°C |
Polyimid-Super-hoch-TG-Material | 250°C | 230°C |
ome common high-frequency materials do not mention TGs in their datasheets. This is due to the original meaning of TG: "temperature of glass transition". Many ceramics- or PTFE-based materials do simply not contain any glass fibres and therefore have no technical TG. Generally, this fact also applies to Polyimides (PI). However, you can usually assume a TG of at least 200°C for Polyimide, ceramics or PTFE-materials. In this case the TG simply stands for temperature resistance.
You may apply the following values:
Material type | Typical „TG“ |
CEM1 | 110-130°C |
FR4 | 120-180°C |
PTFE | 200-260°C |
Ceramic | 200-300°C |
Polyimide | 200-350°C |
YMS High Tg PCB manufacturing capabilities:
YMS High Tg PCB manufacturing capabilities overview |
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Función | capacidades | |
Reconto de capas | 3-60L | |
Tecnoloxía PCB multicapa dispoñible | Orificio pasante con relación de aspecto 16: 1 | |
enterrado e cego vía | ||
Híbrido | High Frequency Material such as RO4350B and FR4 TG 180°Mix etc. | |
High Speed Material such as M7NE and FR4 TG 180°Mix etc. | ||
Espesor | 0,3 mm-8 mm | |
Ancho e espazo mínimo da liña | 0.05mm / 0.05mm (2mil / 2mil) | |
BGA PITCH | 0,35 mm | |
Tamaño mínimo perforado mecánico | 0,15 mm (6 millas) | |
Relación de aspecto para o burato pasante | 16: 1 | |
Acabado superficial | HASL, HASL sen chumbo, ENIG, estaño de inmersión, OSP, prata de inmersión, dedo de ouro, ouro duro galvanizado, OSP selectivo , ENEPIG.etc. | |
Opción de recheo vía | A vía está chapada e chea de epoxi condutora ou non condutora e logo tapada e chapada (VIPPO) | |
Enchido de cobre, cheo de prata | ||
Rexistro | ± 4mil | |
Máscara de soldar | Verde, vermello, amarelo, azul, branco, negro, roxo, negro mate, verde mate.etc. |
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