Double sided pcb Normal pcb Lead free HASL Counterbore Manufacturer | YMS PCB
HAL(Lead Free), the full name is Hot Air leveling with Lead Free. Compared with HASL, the main difference for HAL(Lead Free) is the element of material which do not contain Lead(Pb), so it’s RoHS Compliant and it’s much more popular and widely used in fabricación de PCB .
HAL(Lead Free) requires higher run temperatures for lead free solder and longer contact time, the production cost for HAL(Lead Free) is slightly higher than HASL(Tin/Lead).
The manufacturing process of HAL(Lead Free) is similar to HASL(Tin/Lead), the circuit boards will be submersed in molten solder(Lead Free). This solder will cover all the exposed copper surfaces. Upon retraction from the solder, high pressure hot air is blown over the surface through air knives, this levels the solder deposit and removes the excess solder from the surface of printed circuit boards.
Introdución ao circuíto impreso
Placa de circuíto impreso normal: Most PCBs for simple electronics are simple and composed of only a single layer. More sophisticated hardware such as computer graphics cards or motherboards can have 2 or multiple layers, sometimes up to twelve.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.
What is the difference between a Countersink and a Counterbore?
Capacidades de fabricación de PCB normais YMS:
| Descrición xeral das capacidades de fabricación de PCB normais YMS | ||
| Función | capacidades | |
| Reconto de capas | 1-60 L | |
| Tecnoloxía normal de PCB dispoñible | Orificio pasante con relación de aspecto 16: 1 | |
| enterrado e cego vía | ||
| Híbrido | Material de alta frecuencia como RO4350B e FR4 Mix etc. | |
| Material de alta velocidade como M7NE e FR4 Mix etc. | ||
| de materiais | CEM- | CEM-1; CEM-2 ； CEM-4 ； CEM-5.etc |
| FR4 | EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF, NP170G etc. | |
| alta velocidade | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, serie N4000-13, MW4000, MW2000, TU933 etc. | |
| alta frecuencia | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27, etc. | |
| Outros | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000, PEEK, PTFE, a base de cerámica, etc. | |
| Espesor | 0,3 mm-8 mm | |
| Espesor máximo de cobre | 10 OZ | |
| Ancho e espazo mínimo da liña | 0.05mm / 0.05mm (2mil / 2mil) | |
| BGA PITCH | 0,35 mm | |
| Tamaño mínimo perforado mecánico | 0,15 mm (6 millas) | |
| Relación de aspecto para o burato pasante | 16 ： 1 | |
| Acabado superficial | HASL, HASL sen chumbo, ENIG, estaño de inmersión, OSP, prata de inmersión, dedo de ouro, ouro duro galvanizado, OSP selectivo ， ENEPIG.etc. | |
| Opción de recheo vía | A vía está chapada e chea de epoxi condutora ou non condutora e logo tapada e chapada (VIPPO) | |
| Enchido de cobre, cheo de prata | ||
| Rexistro | ± 4mil | |
| Máscara de soldar | Verde, vermello, amarelo, azul, branco, negro, roxo, negro mate, verde mate.etc. | |
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