HDI PCB 12 Layer 2 Step HDI Board | YMS PCB

Descrición curta:

HDI PCB is the short form of high-density interconnect printed circuit board, a kind of printed circuit board manufacturing technology.

Un PCB HDI is a circuit board with a relatively high circuit density that uses micro-blind and buried “via”—or the copper-plated holes in PCBs—technology.

HDI PCB are compact products designed for small-capacity users, as they cost much more than standard PCB.

The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers.

For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism.

You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

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Detalles do produto

FAQ

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parámetros

Capas: 12

Base Material:FR4 High Tg EM827

Espesor ： 1,2 ± 0,1 mm

Min.Hole Size：0.15mm

Minimum Line Width/Space：0.075mm/0.075mm

Distancia mínima entre capa interior PTH e liña ： 0,2 mm

Size：101mm×55mm

Proporción: 8: 1

tratamento de superficie: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Aplicacións: Telecomunicacións

What is HDI PCBs?

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the PCB HDI design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

1.Multi paso HDI permite a conexión entre todas as capas;

procesamento con láser 2.Cross-capa pode aumentar o nivel de multi-paso HDI calidade;

3.O combinación de HDI e materiais de alta frecuencia, de laminados a base de metal, CPE e outros laminados e procesos especiais permiten que as necesidades de alta densidade e alta frecuencia, condutora de calor elevado, ou conxunto de 3D.

Capacidades de fabricación de PCB YMS HDI :

Descrición xeral das capacidades de fabricación de PCB YMS HDI
Función	capacidades
Reconto de capas	4-60L
Tecnoloxía de PCB HDI dispoñible	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Calquera capa
Espesor	0,3 mm-6 mm
Ancho e espazo mínimo da liña	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35 mm
Tamaño mínimo perforado con láser	0,075 mm (3 nil)
Tamaño mínimo perforado mecánico	0,15 mm (6 millas)
Relación de aspecto para burato láser	0,9: 1
Relación de aspecto para o burato pasante	16: 1
Acabado superficial	HASL, HASL sen chumbo, ENIG, estaño de inmersión, OSP, prata de inmersión, dedo de ouro, ouro duro galvanizado, OSP selectivo ， ENEPIG.etc.
Opción de recheo vía	A vía está chapada e chea de epoxi condutora ou non condutora e logo tapada e recuberta
	Enchido de cobre, cheo de prata
	Láser mediante peche de cobre
Rexistro	± 4mil
Máscara de soldar	Verde, vermello, amarelo, azul, branco, negro, roxo, negro mate, verde mate.etc.