Double sided pcb Normal pcb Lead free HASL Counterbore Manufacturer | YMS PCB
HAL(Lead Free), the full name is Hot Air leveling with Lead Free. Compared with HASL, the main difference for HAL(Lead Free) is the element of material which do not contain Lead(Pb), so it’s RoHS Compliant and it’s much more popular and widely used in saothrachaidh PCM .
HAL(Lead Free) requires higher run temperatures for lead free solder and longer contact time, the production cost for HAL(Lead Free) is slightly higher than HASL(Tin/Lead).
The manufacturing process of HAL(Lead Free) is similar to HASL(Tin/Lead), the circuit boards will be submersed in molten solder(Lead Free). This solder will cover all the exposed copper surfaces. Upon retraction from the solder, high pressure hot air is blown over the surface through air knives, this levels the solder deposit and removes the excess solder from the surface of printed circuit boards.
Ro-ràdh Bòrd Clò-bhuailte
Bòrd cuairteachaidh clò-bhuailte àbhaisteach: Most PCBs for simple electronics are simple and composed of only a single layer. More sophisticated hardware such as computer graphics cards or motherboards can have 2 or multiple layers, sometimes up to twelve.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.
What is the difference between a Countersink and a Counterbore?
YMS Comasan saothrachaidh àbhaisteach PCB:
| Sealladh farsaing air comasan saothrachaidh PCM YMS | ||
| Feart | comasan | |
| Cunntas sreathan | 1-60L | |
| Teicneòlas PCB àbhaisteach ri fhaighinn | Tro tholl le Co-mheas Gnìomh 16: 1 | |
| adhlaicte agus dall via | ||
| Hibrid | Stuthan tricead àrd leithid RO4350B agus FR4 Mix msaa. | |
| Stuth Àrd-astar leithid M7NE agus FR4 Mix msaa. | ||
| Stuth | CEM- | CEM-1; CEM-2 ； CEM-4 ； CEM-5.etc |
| FR4 | EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF, NP170G msaa. | |
| Àrd Gaoithe | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, Sreath N4000-13, MW4000, MW2000, TU933 msaa. | |
| Àrd Frequency | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 msaa. | |
| Feadhainn eile | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000, PEEK, PTFE, stèidhichte air ceramic msaa. | |
| Tiugh | 0.3mm-8mm | |
| Tiugh Max.copper | 10 oz | |
| Leud is àite as ìsle | 0.05mm / 0.05mm (2mil / 2mil) | |
| BGA PITCH | 0.35mm | |
| Meud drile meacanaigeach | 0.15mm (6mil) | |
| Co-mheas Aspect airson tro tholl | 16 ： 1 | |
| Crìoch uachdar | HASL, HASL luaidhe an-asgaidh, ENIG, Tun bogaidh, OSP, Airgead bogaidh, meur òir, òr cruaidh dealanach, OSP roghnach ， ENEPIG.etc. | |
| Tro Roghainn Lìon | Tha an via air a phlàstadh agus air a lìonadh le epoxy seoltach no neo-ghiùlain agus an uairsin air a ribeadh agus a chur thairis (VIPPO) | |
| Copar air a lìonadh, airgead air a lìonadh | ||
| Clàradh | ± 4mil | |
| Measg solder | Uaine, dearg, buidhe, gorm, geal, dubh, purpaidh, dubh dubh, uaine matte.etc. | |
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