High Frequency PCBs manufacturing PTFE and FR4 Hybrid blind via| YMSPCB

Short Description:

In general terms, the PCB industry considers an RF circuit board to be any high frequency PCB that operates above 100MHz. Within the radio frequency class, anything above 2GHz is a Microwave PCB.

Parameters

Layers: 4L Hybrid or Mixed Dielectric Boards (PTFE/FR-4 combinations)

Board Thinkness:0.8mm

Base Material:RO4730G3+IT180A

Min Holes:0.2mm

Minimum Line Width/Clearance：0.075mm/0.075mm

Minimum Clearance between Inner Layer PTH and Line： 0.2mm

Size：187.61mm×103.45mm

Aspect Ratio：4 : 1

Surface treatment：ENEPIG

Speciality: Tight Etch Tolerances on Critical RF Features:+/- .0005″ standard tolerance for unplated 0.5oz copper,Blind/Buried and Laser Via’s,ENEPIG

Differential impedance 100+7/-8Ω, 50+5/-5Ω

Applications:Micro-wave

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What is RF & Microwave PCB ?

Radio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the medium frequency to extremely high frequency ranges (megahertz to gigahertz). These ranges are used for communication signals in everything from mobile phones to military radars.

The materials used are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion). These materials can be mixed in the same Stack-Up for optimal performance and economics.

In order to meet increasing demands for Microwave & RF Printed Circuit Boards for our customers all around the world, we have increased our investment over the last few years so that we have become a world class manufacturer of PCBs using high frequency laminates.

YMS Microwave & RF PCB manufacturing capabilities:

YMS Microwave/RF PCB manufacturing capabilities overview
Feature	capabilities
Layer Count	2-14L
Available Microwave/RF PCB Technology	Through hole with Aspect Ratio 16:1
	buried and blind via
	Mixed Dielectric Boards (PTFE+FR-4 combinations )
	Suitable Microwave/RF Materials available : PTFE, FR4, Polymide, Polyester, Ceramic
	Tight Etch Tolerances on Critical RF Features:+/- .0005" standard tolerance for unplated 0.5oz copper
	Multilevel cavity constructions, Copper coins and slugs, Metal Core & Metal Back, Thermally conductive laminates,Edge Plating, etc.
Thickness	0.3mm-8mm
Minimum line Width and Space	0.075mm/0.075mm(3mil/3mil)
BGA PITCH	0.35mm
Min laser Drilled Size	0.075mm(3nil)
Min mechanical Drilled Size	0.15mm(6mil)
Aspect Ratio for laser hole	0.9:1
Aspect Ratio for through hole	16:1
Surface Finish	Suitable Microwave/RF PCB urface finishes: Electroless Nickel, Immersion Gold, ENEPIG, Lead free HASL,Immersion Silver
Via Fill Option	The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over(VIPPO)
	Copper filled, silver filled
	Laser via copper plated shut
Registration	±4mil
Solder Mask	Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc.