HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Cur síos achomair:

Boird chiorcad priontáilte HDI offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

paraiméadair

Sraitheanna: 8

Base Material:FR4 High Tg EM827

Tiús: 1.6 ± 0.10mm

Min.Hole Size：0.15mm

Íosta Line Leithead / Space: 0.10mm / 0.10mm

Íos-Imréiteach idir Ciseal Istigh PTH agus Líne ： 0.2mm

Méid: 222mm × 120mm

Aspect Ratio：10.6 : 1

Cóireála dromchla: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Iarratais: Ríomhaire

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Sonraigh Táirge

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Táirge Clibeanna

Is é HDI PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

Phróiseas táirgthe Bord HDI:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Ar an iomlán, tá an próiseas táirgthe HDI phláta casta, a chaithfear a chomhlánú tar éis go leor uair de tháirgeadh ar feadh i bhfad. Tá sé ní amháin na ceanglais ard i gcás an cruinneas agus crapadh smacht a fháil ar gach ciseal, chomh maith le caighdeáin arda in ábhair, trealamh, comhshaol agus pearsanra teicniúla.

YMS HDI PCB manufacturing capabilities:

Forbhreathnú ar chumais déantúsaíochta YMS HDI PCB
Gné	cumais
Líon Sraitheanna	4-60L
Teicneolaíocht PCB HDI atá ar fáil	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Aon chiseal
Tiús	0.3mm-6mm
Leithead agus Spás Íosta líne	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35mm
Méid Druileáilte Min léasair	0.075mm (3nil)
Méid Druileáilte Min meicniúil	0.15mm (6mil)
Cóimheas Gné le haghaidh poll léasair	0.9: 1
Cóimheas Gné le haghaidh trí pholl	16: 1
Críochnaigh Dromchla	HASL, HASL saor ó luaidhe, ENIG, Stáin Tumoideachais, OSP, Airgead Tumoideachais, Méar Óir, Óir Crua Leictreaphlátála, OSP Roghnach ， ENEPIG.etc.
Trí Rogha Líon	Déantar an via a phlátáil agus a líonadh le eapocsa seoltaí nó neamh-seoltaí agus ansin tá sé uasteorannaithe agus plátáilte air
	Copar líonta, airgead líonta
	Léasair trí dhúnadh plátáilte copair
Clárú	± 4mil
Masc solder	Glas, Dearg, Buí, Gorm, Bán, Dubh, Corcra, Neamhlonrach Dubh, Neamhlonrach glas.etc.