Double sided pcb Normal pcb Lead free HASL Counterbore Manufacturer | YMS PCB
HAL(Lead Free), the full name is Hot Air leveling with Lead Free. Compared with HASL, the main difference for HAL(Lead Free) is the element of material which do not contain Lead(Pb), so it’s RoHS Compliant and it’s much more popular and widely used in déantúsaíochta PCB.
HAL(Lead Free) requires higher run temperatures for lead free solder and longer contact time, the production cost for HAL(Lead Free) is slightly higher than HASL(Tin/Lead).
The manufacturing process of HAL(Lead Free) is similar to HASL(Tin/Lead), the circuit boards will be submersed in molten solder(Lead Free). This solder will cover all the exposed copper surfaces. Upon retraction from the solder, high pressure hot air is blown over the surface through air knives, this levels the solder deposit and removes the excess solder from the surface of printed circuit boards.
Réamhrá an Bhoird Chuarda Clóbhuailte
Gnáth-Bhord Cuarda Clóbhuailte: Most PCBs for simple electronics are simple and composed of only a single layer. More sophisticated hardware such as computer graphics cards or motherboards can have 2 or multiple layers, sometimes up to twelve.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.
What is the difference between a Countersink and a Counterbore?
YMS Gnáthchumais déantúsaíochta PCB:
| YMS Forbhreathnú ar ghnáthchumais déantúsaíochta PCB | ||
| Gné | cumais | |
| Líon Sraitheanna | 1-60L | |
| Gnáththeicneolaíocht PCB atá ar fáil | Trí pholl le Cóimheas Gné 16: 1 | |
| adhlactha agus dall trí | ||
| Hibrid | Ábhar Ard-Minicíochta mar RO4350B agus FR4 Mix srl. | |
| Ábhar Ardluais mar M7NE agus FR4 Mix srl. | ||
| Ábhar | CEM- | CEM-1; CEM-2 ； CEM-4 ； CEM-5.etc |
| FR4 | EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF, NP170G etc. | |
| Luas ard | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, Sraith N4000-13, MW4000, MW2000, TU933 srl. | |
| Ard Minicíocht | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 etc. | |
| Daoine eile | Polaimíd, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000, PEEK, PTFE, ceirmeach-bhunaithe srl. | |
| Tiús | 0.3mm-8mm | |
| Tiús Max.copper | 10OZ | |
| Leithead agus Spás Íosta líne | 0.05mm / 0.05mm (2mil / 2mil) | |
| BGA PITCH | 0.35mm | |
| Méid Druileáilte Min meicniúil | 0.15mm (6mil) | |
| Cóimheas Gné le haghaidh trí pholl | 16 ： 1 | |
| Críochnaigh Dromchla | HASL, HASL saor ó luaidhe, ENIG, Stáin Tumoideachais, OSP, Airgead Tumoideachais, Méar Óir, Óir Crua Leictreaphlátála, OSP Roghnach ， ENEPIG.etc. | |
| Trí Rogha Líon | Déantar an via a phlátáil agus a líonadh le eapocsa seoltaí nó neamh-seoltaí agus ansin uasteorannú agus plátáil air (VIPPO) | |
| Copar líonta, airgead líonta | ||
| Clárú | ± 4mil | |
| Masc solder | Glas, Dearg, Buí, Gorm, Bán, Dubh, Corcra, Neamhlonrach Dubh, Neamhlonrach glas.etc. | |
Is Féidir Leat:
1 、Summary of matters needing attention in circuit board welding
3 、What is PCB
4、Cad is tástáil bhoird lom ann?
Níos mó a fhoghlaim faoi tháirgí YMS
