HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Koarte beskriuwing:

HDI printe circuit boards offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

parameters

Layers: 8

Base Material:FR4 High Tg EM827

Thickness: 1.6 ± 0.10mm

Min.Hole Size：0.15mm

Minimum Line Breedte / Space: 0.10mm / 0.10mm

Minimale ôfstân tusken binnenlaach PTH en line ： 0.2mm

Size: 222mm × 120mm

Aspect Ratio：10.6 : 1

Oerflak treatment: enig

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Applications: Computer

E-post stjoere oan ús Download as PDF

produkt Detail

FAQ

produkt Tags

HDI PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI Board produksjeproses:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Op de gehiel, it produksjeproses fan HDI plaat is kompleks, dat moat wurde ôfmakke nei in protte tiden fan produksje foar in lange tiid. It is net allinnich hege easken foar de krektens en krimp kontrôle fan eltse laach, mar ek hege easken yn materialen, apparatuer, miljeu en technyske personiel.

YMS HDI PCB manufacturing capabilities:

YMS HDI PCB produksje mooglikheden oersjoch
Eigenskip	mooglikheden
Laach telle	4-60L
Beskikbere HDI PCB Technology	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Eltse laach
Dikte	0,3 mm-6 mm
Minimale rigelbreedte en romte	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35 mm
Min laser boarre Grutte	0,075mm (3nul)
Min meganyske boarre Grutte	0,15 mm (6mil)
Aspektferhâlding foar lasergat	0.9: 1
Aspektferhâlding foar trochgeand gat	16: 1
Oerflakte ôfwurking	HASL, Lead free HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP ， ENEPIG.etc.
Fia Folje-opsje	De fia wurdt pleatst en fol mei geleidend as net-geleidend epoksy, dan ôfsluten en oerplakt
	Koper fol, sulver fol
	Laser fia koper plated ticht
Ynskriuwing	± 4mil
Solder Masker	Grien, read, giel, blau, wyt, swart, pears, mat swart, mat grien. Ensfh.