Double sided pcb Normal pcb Lead free HASL Counterbore Manufacturer | YMS PCB
HAL(Lead Free), the full name is Hot Air leveling with Lead Free. Compared with HASL, the main difference for HAL(Lead Free) is the element of material which do not contain Lead(Pb), so it’s RoHS Compliant and it’s much more popular and widely used in PCB .
HAL(Lead Free) requires higher run temperatures for lead free solder and longer contact time, the production cost for HAL(Lead Free) is slightly higher than HASL(Tin/Lead).
The manufacturing process of HAL(Lead Free) is similar to HASL(Tin/Lead), the circuit boards will be submersed in molten solder(Lead Free). This solder will cover all the exposed copper surfaces. Upon retraction from the solder, high pressure hot air is blown over the surface through air knives, this levels the solder deposit and removes the excess solder from the surface of printed circuit boards.
Ynlieding foar printplaten
Normaal Printed Circuit Board: Most PCBs for simple electronics are simple and composed of only a single layer. More sophisticated hardware such as computer graphics cards or motherboards can have 2 or multiple layers, sometimes up to twelve.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.
What is the difference between a Countersink and a Counterbore?
YMS Normale PCB-produksjemooglikheden:
| YMS Normaal PCB produksjemooglikheden oersjoch | ||
| Eigenskip | mooglikheden | |
| Laach telle | 1-60L | |
| Beskikbere Normale PCB Technology | Troch gat mei Aspektferhâlding 16: 1 | |
| begroeven en blyn fia | ||
| Hybride | Materiaal mei hege frekwinsje lykas RO4350B en FR4 Mix ensfh. | |
| Materiaal mei hege snelheid lykas M7NE en FR4 Mix ensfh. | ||
| Materiaal | CEM- | CEM-1; CEM-2, CEM-4, CEM-5.etc |
| FR4 | EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF, NP170G ensfh. | |
| Hege snelheid | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 Series, MW4000, MW2000, TU933 ensfh. | |
| Hege frekwinsje | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 ensfh. | |
| Oaren | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000, PEEK, PTFE, keramyk-basearre ensfh. | |
| Dikte | 0,3 mm-8 mm | |
| Maks. Koperdikte | 10OZ | |
| Minimale rigelbreedte en romte | 0.05mm / 0.05mm (2mil / 2mil) | |
| BGA PITCH | 0.35 mm | |
| Min meganyske boarre Grutte | 0,15 mm (6mil) | |
| Aspektferhâlding foar trochgeand gat | 16 ： 1 | |
| Oerflakte ôfwurking | HASL, Lead free HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP ， ENEPIG.etc. | |
| Fia Folje-opsje | De fia is pleatst en fol mei geleidend as net-geleidend epoksy, dan bedekt en pleatst oer (VIPPO) | |
| Koper fol, sulver fol | ||
| Ynskriuwing | ± 4mil | |
| Solder Masker | Grien, read, giel, blau, wyt, swart, pears, mat swart, mat grien. Ensfh. | |
Jo kinne leuk fine:
1, Summary of matters needing attention in circuit board welding
3, What is PCB
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