HDI PCB 12 Layer 2 Step HDI Board | YMS PCB

Koarte beskriuwing:

HDI PCB is the short form of high-density interconnect printed circuit board, a kind of printed circuit board manufacturing technology.

In HDI PCB is a circuit board with a relatively high circuit density that uses micro-blind and buried “via”—or the copper-plated holes in PCBs—technology.

HDI PCB are compact products designed for small-capacity users, as they cost much more than standard PCB.

The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers.

For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism.

You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

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produkt Detail

FAQ

produkt Tags

parameters

Lagen: 12

Base Material:FR4 High Tg EM827

Dikte ： 1,2 ± 0,1 mm

Min.Hole Size：0.15mm

Minimum Line Width/Space：0.075mm/0.075mm

Minimale ôfstân tusken binnenlaach PTH en line ： 0.2mm

Size：101mm×55mm

Aspect Ratio: 8: 1

Oerflak treatment: enig

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Applications: Telecommunication

What is HDI PCBs?

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

1.Multi-stap HDI stelt de ferbining tusken alle lagen;

2.Cross-layer laser ferwurkjen ta it ferheegjen fan de kwaliteit nivo fan multi-stap HDI;

3. De kombinaasje fan HDI en hege-frekwinsje materialen, metaal-basearre laminates, SENSOR en oare bysûndere laminates en prosessen ynskeakelje it ferlet fan hege tichtheid en hege frekwinsje, hege waarmte it fieren, of 3D gearkomste.

YMS HDI PCB-produksjekapasiteit :

YMS HDI PCB produksje mooglikheden oersjoch
Eigenskip	mooglikheden
Laach telle	4-60L
Beskikbere HDI PCB Technology	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Eltse laach
Dikte	0,3 mm-6 mm
Minimale rigelbreedte en romte	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35 mm
Min laser boarre Grutte	0,075mm (3nul)
Min meganyske boarre Grutte	0,15 mm (6mil)
Aspektferhâlding foar lasergat	0.9: 1
Aspektferhâlding foar trochgeand gat	16: 1
Oerflakte ôfwurking	HASL, Lead free HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP ， ENEPIG.etc.
Fia Folje-opsje	De fia wurdt pleatst en fol mei geleidend as net-geleidend epoksy, dan ôfsluten en oerplakt
	Koper fol, sulver fol
	Laser fia koper plated ticht
Ynskriuwing	± 4mil
Solder Masker	Grien, read, giel, blau, wyt, swart, pears, mat swart, mat grien. Ensfh.