HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Lyhyt kuvaus:

HDI painetut piirilevyt offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

parametrit

Kerroksia: 8

Base Material:FR4 High Tg EM827

Paksuus: 1,6 ± 0,10 mm

Min.Hole Size：0.15mm

Pienin linjan leveys / Space: 0,10 mm / 0,10 mm

Pienin välys sisäkerroksen PTH ja viivan välillä ： 0,2 mm

Koko: 222mm x 120mm

Aspect Ratio：10.6 : 1

Pintakäsittely: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Sovellukset: Tietokone

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Tuotetiedot

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tuotteen Tunnisteet

HDI-piirilevy is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI Board tuotantoprosessi:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Koko tuotantoprosessi HDI levy on monimutkainen, joka on saatettava loppuun sen jälkeen, kun monta kertaa tuotannon pitkään. Se ei ole vain korkeat vaatimukset tarkkuuden ja kutistuminen ohjaus kunkin kerroksen, mutta myös korkeat standardit materiaalien, laitteiden, ympäristö ja tekninen henkilöstö.

YMS HDI PCB manufacturing capabilities:

YMS HDI -piirilevyjen valmistusominaisuudet
Ominaisuus	ominaisuuksia
Kerroslaskenta	4-60L
Saatavilla oleva HDI-piirilevytekniikka	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Mikä tahansa kerros
Paksuus	0,3 mm - 6 mm
Pienin viivan leveys ja tila	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35 mm
Pienin porakoko laserilla	0,075 mm (3 nolla)
Pienin mekaaninen porattu koko	0,15 mm (6 miljoonaa)
Lasereiän kuvasuhde	0,9: 1
Läpireikän kuvasuhde	16: 1
Pinnan viimeistely	HASL, lyijytön HASL, ENIG, upotuspeltti, OSP, upotushopea, kultasormi, kovakalvon galvanointi, valikoiva OSP ， ENEPIG.etc.
Täyttövaihtoehdon kautta	Läpivienti pinnoitetaan ja täytetään joko johtavalla tai ei-johtavalla epoksilla, sitten suljetaan ja pinnoitetaan
	Kupari täytetty, hopea täytetty
	Kuparilla päällystetty laser suljettu
Rekisteröinti	± 4mil
Juotosmaski	Vihreä, punainen, keltainen, sininen, valkoinen, musta, violetti, mattamusta, mattavihreä jne.