HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB
PCI HDI is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.
HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.
HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.
فرایند تولید HDI انجمن:
At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.
در کل، فرایند تولید ورق HDI پیچیده است، که نیاز به پس از چند بار تولید برای یک مدت طولانی به پایان خواهد رسید. این نه تنها مورد نیاز بالا برای دقت و انقباض کنترل هر یک از لایه، بلکه استانداردهای بالا در مواد و تجهیزات، محیط زیست و پرسنل فنی.
YMS HDI PCB manufacturing capabilities:
بررسی اجمالی قابلیت های تولید YMS HDI PCB | |
ویژگی | توانایی ها |
تعداد لایه ها | 4-60 لیتر |
فناوری HDI PCB موجود | 1 + N + 1 |
2 + N + 2 | |
3 + N + 3 | |
4 + N + 4 | |
5 + N + 5 | |
هر لایه ای | |
ضخامت | 0.3mm-6mm |
حداقل عرض و فاصله خط | 0.05 میلی متر / 0.05 میلی متر (2 میلی لیتر / 2 میلی لیتر) |
BGA PITCH | 0.35 میلی متر |
حداقل اندازه مته لیزر | 0.075 میلی متر (3 نیل) |
حداقل اندازه حفاری مکانیکی | 0.15 میلی متر (6 میلی لیتر) |
نسبت ابعاد برای سوراخ لیزر | 0.9: 1 |
نسبت ابعاد از طریق سوراخ | 16: 1 |
پایان سطح | HASL ، HASL بدون سرب ، ENIG ، قلع غوطه وری ، OSP ، نقره غوطه وری ، انگشت طلا ، آبکاری طلای سخت ، OSP انتخابی EP ENEPIG.etc. |
از طریق گزینه پر کردن | ویا آبکاری شده و با اپوکسی رسانا یا غیر رسانا پر شده و سپس درب دار و پوشانده می شود |
مس پر ، نقره پر شده است | |
لیزر از طریق مس اندود شده | |
ثبت | 4 میلیون پوند |
ماسک جوشکاری | سبز ، قرمز ، زرد ، آبی ، سفید ، سیاه ، بنفش ، سیاه مات ، سبز مات و غیره |
درباره محصولات YMS بیشتر بدانید
What is HDI material?
FR4 Fiberglass board or ceramic board
Are printed circuit boards still used?
Yes,the Printed circuit board(PCB) is the foundation of electronic equipment, and it can be found in every electronic device in today ’s world
What is the major disadvantage of printed circuit boards?
1.single use 2.environmental pollution 3.high cost
Is there gold in printed circuit boards?
yes,there is